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1.发明申请ELECTROCONDUCTIVE LAYER, LAMINATE USING THE SAME, AND PRODUCING PROCESSES THEREOF 有权电绝缘层，使用它的层压板及其制造方法公开(公告)号：US20090197109A1
公开(公告)日：2009-08-06
申请号：US12352048
申请日：2009-01-12
CPC分类号： H05K3/388 , H05K3/384 , H05K2201/0355 , H05K2203/0353 , H05K2203/0361 , Y10T428/12431 , Y10T428/12493 , Y10T428/12569 , Y10T428/12708
摘要： The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.
摘要翻译： 本发明的目的是提供一种导电层，其保持与树脂层的粘合性，并且还可以在随后的步骤中容易地除去铜 - 锡合金层的层，使用该层的层压体和制造方法 其中。 本发明的导电层是与树脂层接合并且在铜层上层叠有铜层和铜 - 锡合金层的导电层，其中，铜 - 锡合金层的厚度 0.001至0.020毫克。
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公开(公告)号：US20100000971A1
公开(公告)日：2010-01-07
申请号：US12495247
申请日：2009-06-30
CPC分类号： C09J11/02 , C08K3/16 , C08K3/32 , C08K5/04 , C08K5/405 , H05K3/386 , H05K2201/0355 , H05K2203/121
摘要： An object of the present invention is to provide an adhesive layer forming liquid about which deterioration in adhesive-layer-forming capability with the passage of time can be restrained and further the smoothness of an adhesive layer surface can be certainly kept. The adhesive layer forming liquid of the present invention is an adhesive layer forming liquid, which is a liquid for forming an adhesive layer for bonding copper and a resin to each other, and which is an aqueous solution comprising an acid, a stannic salt, a complexing agent, a stabilizer, and a complexing restrainer for restraining a complexing reaction between the complexing agent and copper.
摘要翻译： 本发明的目的是提供一种粘合剂层形成液体，可以抑制粘合剂层形成能力随时间的劣化，并且可以可靠地保持粘合剂层表面的平滑性。 本发明的粘合剂层形成液是作为用于形成用于将铜和树脂粘合的粘合剂层形成用的液体的粘合剂层形成液，其是含有酸，锡， 络合剂，稳定剂和抑制络合剂与铜之间络合反应的络合抑制剂。
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公开(公告)号：US20100108531A1
公开(公告)日：2010-05-06
申请号：US12610437
申请日：2009-11-02
CPC分类号： C25D5/48 , H05K3/384 , H05K2203/0361 , H05K2203/073
摘要： The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.
摘要翻译： 本发明的目的是提供一种能够容易地保持形成粘合剂层的性能并且确实地保持与树脂的粘合性的粘合剂层形成液体以及使用该液体的粘合剂层形成方法。 本发明的粘合剂层形成液是用于形成用于将铜和树脂粘合的粘合剂层的粘合剂层形成液体，其是包含酸，亚锡盐，锡盐，络合剂的水溶液 和稳定剂，并且其被制备以在制备时将B / A的值设定为0.010以上至1.000以下，其中，A表示作为所述的亚锡盐的浓度（单位：质量％） 二价锡离子的浓度，B表示作为四价锡离子的浓度的锡盐的浓度（单位：质量％）。
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公开(公告)号：US20100236690A1
公开(公告)日：2010-09-23
申请号：US12708657
申请日：2010-02-19
IPC分类号： B32B38/00
CPC分类号： H05K3/389 , B32B37/203 , B32B38/0012 , B32B2037/243 , B32B2038/168 , B32B2309/02 , B32B2309/04 , B32B2457/00 , H05K1/0269 , H05K3/022 , H05K2201/0355 , H05K2203/1476 , H05K2203/163
摘要： The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of Si—O is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range.
摘要翻译： 本发明的层叠体的形成方法是层叠体的形成方法，其包括将硅烷偶联剂的水溶液涂布在金属层的表面上的硅烷偶联剂处理工序，将所得的涂膜干燥 形成硅烷偶联剂涂层，以及在硅烷偶联剂涂层上层叠树脂层的层压步骤，连续进行这些步骤，其中当通过FT-IR在硅烷偶联剂处理步骤中分析形成的硅烷偶联剂涂层时 利用反射吸收光谱法，然后将Si-O的峰面积变为小于预定阈值的值，至少一部分硅烷偶联剂的水溶液被更新，从而进行硅烷偶联剂处理，同时 将峰面积控制在预定范围内。
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公开(公告)号：US20120260821A1
公开(公告)日：2012-10-18
申请号：US13446962
申请日：2012-04-13
申请人： Yoichi SENGOKU , Masami TSUTAE , Kiyoto TAI , Keisuke JOKO , Tsuyoshi AMATANI
发明人： Yoichi SENGOKU , Masami TSUTAE , Kiyoto TAI , Keisuke JOKO , Tsuyoshi AMATANI
IPC分类号： C09J9/00
CPC分类号： C23C22/52 , C23C18/1689 , C23C22/68 , H05K3/0079 , H05K3/108 , H05K2203/124
摘要： Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
摘要翻译： 本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，具有酸解离常数的倒数的对数的酸 在25℃下为3〜8，其盐在25℃下的pH为4以上7以下，可以稳定地形成用于提高铜与感光性树脂之间的粘合性的涂层，即使在 连续或反复使用; 以及形成用于将铜结合到感光性树脂上的涂层的方法，其包括使铜的表面与涂覆液形成液体组合物接触以形成涂层。
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