公开(公告)号：US20230387344A1

公开(公告)日：2023-11-30

申请号：US18310002

申请日：2023-05-01

Applicant: NICHIA CORPORATION

Inventor： Yoshiki YAMAGUCHI ,  Hiroki HAYASHI ,  Satoshi OKUMURA ,  Minoru YAMAMOTO ,  Hiroaki TAMEMOTO

IPC: H01L33/00

CPC classification number: H01L33/0095 ,  H01L2933/0066

Abstract: A method of producing a semiconductor device, the method includes steps of: detecting a defect included in a semiconductor layer; forming a metal film on the semiconductor layer; after forming the metal film on the semiconductor layer, exposing the semiconductor layer through the metal film by removing a portion of the metal film by irradiation with a first laser emitting red or infrared light; and after the step of exposing the semiconductor layer, removing a portion of the semiconductor layer by irradiation with a second laser emitting ultraviolet light, said portion of the semiconductor layer including the defect. A diameter of said portion of the metal film is greater than a diameter of said portion of the semiconductor layer in a plan view. Said portion of the metal film overlaps with said portion of the semiconductor layer in the plan view.

公开(公告)号：US20210005777A1

公开(公告)日：2021-01-07

申请号：US16908354

申请日：2020-06-22

Applicant: NICHIA CORPORATION

Inventor： Naoto INOUE ,  Minoru YAMAMOTO ,  Satoshi OKUMURA ,  Hiroki OKAMOTO ,  Hiroaki TAMEMOTO

IPC: H01L33/00

Abstract: A method of manufacturing light emitting elements includes: providing a wafer including a substrate formed of sapphire and having a first main surface and a second main surface, and a semiconductor layered body disposed on the first main surface of the substrate; irradiating a laser beam into the substrate to form a modified region inside the substrate, the modified region having a crack reaching the first main surface and a crack reaching the second main surface; irradiating CO2 laser to a region of the substrate overlapping with a region to which the laser beam has been irradiated; and cleaving the wafer along the modified region to obtain the light emitting elements each having a hexagonal shape in a plan view.