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公开(公告)号:US20220220265A1
公开(公告)日:2022-07-14
申请号:US17604102
申请日:2020-04-16
Applicant: NITTO DENKO CORPORATION
Inventor: Shunji IMAMURA , Shimpei YAKUWA , Kou UEMURA
Abstract: Provided is a plate-shaped composite material which can sufficiently exhibit an interference effect between antenna elements when utilized as, for example, a substrate of a microstrip patch antenna. The interference effect between the antenna elements can be sufficiently exhibited by controlling the composite material so that, when the material is divided into a plurality of regions, a standard deviation of density values of the respective regions is kept at a certain value or less.
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公开(公告)号:US20250110265A1
公开(公告)日:2025-04-03
申请号:US18730130
申请日:2023-01-13
Applicant: Nitto Denko Corporation
Inventor: Naoki NAGAOKA , Daiki KATO , Shimpei YAKUWA , Shunji IMAMURA
IPC: G02B5/08
Abstract: Provided is a reflector having reflection characteristics of a broad frequency band. The reflector includes: a dielectric layer; a conductive layer that is provided on a first surface of the dielectric layer and includes a periodical arrangement of a plurality of conductor patterns; and a ground layer that is provided on a second surface opposite to the first surface. The conductive layer is configured to reflect incident waves at an angle having a size different from that of an incident angle of the incident waves. The dielectric layer has a relative dielectric constant of 2.0 or less.
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公开(公告)号:US20250018684A1
公开(公告)日:2025-01-16
申请号:US18687541
申请日:2022-08-31
Applicant: NITTO DENKO CORPORATION
Inventor: Kyoko ISHII , Yosuke SUGAYA , Takeo INOUE , Tomohiro KONTANI , Shimpei YAKUWA , Shunji IMAMURA
IPC: B32B17/10 , B32B3/26 , B32B5/02 , B32B5/16 , B32B5/18 , B32B17/06 , B32B27/06 , B32B27/08 , B32B27/12 , B32B27/14 , B32B27/28 , B32B27/32 , H01L23/10
Abstract: A cover member suitable for suppressing damage to a semiconductor device package includes: a cover sheet having a shape configured to cover an object in a state of being placed on a placement face; and an adhesive layer joined to the cover sheet and configured to fix the cover member to the placement face. The adhesive layer includes a double-sided adhesive sheet. The double-sided adhesive sheet has a structure in which a first adhesive agent layer, a substrate, and a second adhesive agent layer are laminated in this order. The substrate has a porous structure. The substrate has a porosity of 30% or more. When the porosity of the substrate is 30% or more and 50% or less, the substrate has an average pore diameter of 10 μm or more, and when the porosity of the substrate is more than 50%, the average pore diameter is 0.05 μm or more.
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