公开(公告)号：US20220243994A1

公开(公告)日：2022-08-04

申请号：US17167449

申请日：2021-02-04

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Michael T. Barako ,  Jesse Tice

IPC: F28D15/04 ,  F28D15/02

Abstract: A heat pipe that employs a metal woodpile capillary wick. The heat pipe includes an outer enclosure defining a chamber therein that contains a working fluid, an evaporator section for converting the fluid to vapor in response to being heated from a heat source, and a condenser section for converting the vapor back into the fluid in response to cooling from a heat sink. The wick is positioned within the chamber in contact with the enclosure and extends between the evaporator section and the condenser section. The wick includes a plurality of layers each having spaced apart parallel thermally conductive bars defining channels therebetween, where the bars in adjacent layers are oriented in different directions and where the condensed fluid flows through the channels in the wick from the condenser section to the evaporator section.

公开(公告)号：US20220068752A1

公开(公告)日：2022-03-03

申请号：US17011382

申请日：2020-09-03

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Jesse Tice ,  Steven J. Mass ,  Michael T. Barako

IPC: H01L23/367 ,  H01L21/02 ,  H01L23/66 ,  H01L23/373

Abstract: An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.

公开(公告)号：US12036623B2

公开(公告)日：2024-07-16

申请号：US17498270

申请日：2021-10-11

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Mark W. Knight ,  Patrick W. Shindo ,  Connor Limburg ,  Jesse Tice

IPC: B23K26/00 ,  B05D5/06 ,  B05D7/00 ,  B23K26/362 ,  B64C1/12 ,  B64F5/40

CPC classification number: B23K26/009 ,  B05D5/067 ,  B05D7/5883 ,  B23K26/362 ,  B64C1/12 ,  B64F5/40

Abstract: An aircraft skin coating assembly for an aircraft. The coating assembly includes a primer layer deposited on the aircraft skin, an optical stop-etch layer deposited on the primer layer that is reflective at a predetermined wavelength, a coating stack-up deposited on the optical etch-stop layer that provides performance features for the aircraft, and a sealant layer deposited on the stack-up. When a laser coating removal process employing a laser beam is used to remove the coating stack-up for replacement, the stop-etch layer reflects the laser beam to prevent it from penetrating and possibly damaging the aircraft skin.

公开(公告)号：US20230113120A1

公开(公告)日：2023-04-13

申请号：US17498270

申请日：2021-10-11

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Mark W. Knight ,  Patrick W. Shindo ,  Connor Limburg ,  Jesse Tice

IPC: B23K26/00 ,  B05D5/06 ,  B05D7/00 ,  B23K26/362 ,  B64C1/12

Abstract: An aircraft skin coating assembly for an aircraft. The coating assembly includes a primer layer deposited on the aircraft skin, an optical stop-etch layer deposited on the primer layer that is reflective at a predetermined wavelength, a coating stack-up deposited on the optical etch-stop layer that provides performance features for the aircraft, and a sealant layer deposited on the stack-up. When a laser coating removal process employing a laser beam is used to remove the coating stack-up for replacement, the stop-etch layer reflects the laser beam to prevent it from penetrating and possibly damaging the aircraft skin.

公开(公告)号：US11264299B1

公开(公告)日：2022-03-01

申请号：US17011382

申请日：2020-09-03

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： Jesse Tice ,  Steven J. Mass ,  Michael T. Barako

IPC: H01L23/367 ,  H01L21/02 ,  H01L23/66 ,  H01L23/373

Abstract: An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.