公开(公告)号：US09704823B2

公开(公告)日：2017-07-11

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L23/544

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US10177111B2

公开(公告)日：2019-01-08

申请号：US15450972

申请日：2017-03-06

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L21/683 ,  H01L23/544 ,  H01L21/304

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US10431476B2

公开(公告)日：2019-10-01

申请号：US15935187

申请日：2018-03-26

Applicant: NXP B.V.

Inventor： Jetse de Witte ,  Antonius Hendrikus Jozef Kamphuis ,  Jan Gulpen

IPC: H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L21/683 ,  H01L23/31 ,  H01L23/495 ,  G01R31/28 ,  H01L21/66

Abstract: A method of making a plurality of packaged semiconductor devices. The method includes providing a carrier blank having a die receiving surface and an underside. The method also includes mounting a plurality of semiconductor dies on the die receiving surface, wherein the dies extend to a first height above the die receiving surface. The method further includes depositing an encapsulant on the die receiving surface, wherein an upper surface of the encapsulant is located above said first height. The method also includes singulating to form the plurality of packaged semiconductor devices by sawing into the underside, through the carrier blank and partially through the encapsulant to a depth intermediate the first height and the upper surface, wherein said sawing separates the carrier blank into a plurality of carriers, and removing encapsulant from the upper surface of the encapsulant at least until said saw depth is reached.

公开(公告)号：US20170179076A1

公开(公告)日：2017-06-22

申请号：US15450972

申请日：2017-03-06

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56 ,  H01L23/544 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

公开(公告)号：US20160276176A1

公开(公告)日：2016-09-22

申请号：US14927283

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Roelf Anco Jacob Groenhuis ,  Leonardus Antonius Elisabeth van Gemert ,  Caroline Catharina Maria Beelen-Hendrikx ,  Jetse de Witte ,  Franciscus Henrikus Martinus Swartjes

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20180301353A1

公开(公告)日：2018-10-18

申请号：US15935187

申请日：2018-03-26

Applicant: NXP B.V.

Inventor： Jetse de Witte ,  Antonius Hendrikus Jozef Kamphuis ,  Jan Gulpen

IPC: H01L21/56 ,  H01L21/48 ,  H01L21/78 ,  H01L21/683 ,  H01L21/66 ,  H01L23/31 ,  H01L23/495 ,  G01R31/28

CPC classification number: H01L21/561 ,  G01R31/2886 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/14 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014

Abstract: A method of making a plurality of packaged semiconductor devices. The method includes providing a carrier blank having a die receiving surface and an underside. The method also includes mounting a plurality of semiconductor dies on the die receiving surface, wherein the dies extend to a first height above the die receiving surface. The method further includes depositing an encapsulant on the die receiving surface, wherein an upper surface of the encapsulant is located above said first height. The method also includes singulating to form the plurality of packaged semiconductor devices by sawing into the underside, through the carrier blank and partially through the encapsulant to a depth intermediate the first height and the upper surface, wherein said sawing separates the carrier blank into a plurality of carriers, and removing encapsulant from the upper surface of the encapsulant at least until said saw depth is reached.

公开(公告)号：US09466585B1

公开(公告)日：2016-10-11

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L21/304 ,  H01L21/78 ,  H01L21/683 ,  H01L21/3065

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。

公开(公告)号：US20160276306A1

公开(公告)日：2016-09-22

申请号：US14927311

申请日：2015-10-29

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Leonardus Antonius Elisabeth van Gemert ,  Roelf Anco Jacob Groenhuis ,  Caroline Catharina Maria Beelen-Hendrikx ,  Franciscus Henrikus Martinus Swartjes ,  Jetse de Witte

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/683 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L24/94 ,  H01L21/304 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3164 ,  H01L23/3178 ,  H01L23/544 ,  H01L24/11 ,  H01L24/14 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2223/5446 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2224/11

Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.

Abstract translation: 与示例性实施例一致，晶片衬底经历其中将弹性材料施加到晶片衬底的前侧和后侧表面的处理。 通过在活动装置模具之间限定锯槽中的沟槽，可以在其中放置附加的弹性材料。 在示例性实施例中，在有源器件管芯被分离成单个产品器件之后，所得到的产品器件在封装的有源器件管芯的正面，背面和四个垂直面上具有覆盖。 前侧表面具有暴露的接触区域，使得产品装置可以附接到终端用户的系统电路板。 此外，弹性涂层在组装期间保护封装的主动装置模具免受损坏。