公开(公告)号：US20200126895A1

公开(公告)日：2020-04-23

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

公开(公告)号：US20200273810A1

公开(公告)日：2020-08-27

申请号：US16283853

申请日：2019-02-25

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Amomthep Saiyaitara ,  Chanon Suwankasab ,  Russell Joseph Lynch

IPC: H01L23/552 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/528 ,  H01L23/49 ,  H01L23/495

Abstract: A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.

公开(公告)号：US11049817B2

公开(公告)日：2021-06-29

申请号：US16283853

申请日：2019-02-25

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Russell Joseph Lynch

IPC: H01L23/552 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/49 ,  H01L23/528

Abstract: A shielded semiconductor device has a first die attached to a die pad of a lead frame and a second die attached to a surface of the first die. The first die is electrically connected to inner lead ends of leads that surround the die pad, and the second die is electrically connected to the first die and to an inner end of a shielding lead. A mold compound forms a body around the first and second dies and the electrical connections. Outer lead ends of the leads project from the sides of the body. The outer end of the shielding lead projects from a central location of one side of the body and is bent up the side surface from which it projects and over the top of the body and provides EMI shielding.

公开(公告)号：US10790220B2

公开(公告)日：2020-09-29

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01R12/58

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.