Abstract:
Electronically reinforced head-wearable apparatus and related methods are disclosed. Example glasses include a frame to carry a first lens. The frame defines a first body. A first stem and a second stem are to couple to the frame. The first stem and the second stem define a second body and a third body, respectively. A circuit board defines a circuit to implement the glasses. The circuit board is shaped to define a framework of at least one of the first body of the frame, the second body of the first stem or the third body of the second stem.
Abstract:
The present invention provides a projection system (10), preferably for a head-up display e.g. on board a vehicle, comprising a laser source (1), a diffuser (3) and telecentric optics (2) disposed between the laser and the diffuser so that the telecentric optics outputs parallel rays to the diffuser, the diffused light being thus independent from the incidence angle; each pixel of the projected image has the same brightness, regardless of the angle or of the position from which it is viewed.
Abstract:
Optical MEMS scanning micro-mirror comprising: —a movable scanning micro-mirror (101) pivotally connected to a MEMS body (102) substantially surrounding the lateral sides of the micro-mirror; —an transparent prism (500, 600) substantially covering the reflection side of the micro-mirror; —wherein said prism has its outer face non-parallel to the micro-mirror neutral plane N-N, thereby providing a dual anti-speckle and anti-reflection effect, namely against parasitic light. The invention also provides the corresponding micro-projection system and method for reducing speckle.
Abstract:
A micro scale includes one substrate forming a first zone constituting a first terminal, one conducting vibrating beam which has two opposite ends affixed on two supporting areas on the substrate, the conductive beam forming a second terminal; wherein the conductive beam is made of polymer gel having metallic microparticles in low quantity so as to avoid any contamination of a biological material to measure, the density of the metallic microparticles being high enough to achieve electrical conduction of the second terminal. A manufacturing process of such a micro scale circuit is also provided.
Abstract:
According to the present invention, there is provided an optical device comprising, a plurality of light sources each operable to provide a light beam; at least one beam combiner which is operable to combine the light beams from the plurality of light sources, to provide a combined light beam; a beam splitter, which is arranged to receive the combined light beam and to split the combined light beam into a primary light beam and a secondary light beam, wherein one or more characteristics of the secondary light beam are indicative of one or more characteristics of the primary light beam, wherein the beam splitter comprises a first surface through which the primary light beam is emitted from the beam splitter and a second surface through which the secondary light beam is emitted from the beam splitter; a mirror component which comprises a mirror, wherein the mirror component is arranged such that the mirror can reflect the primary light beam which is emitted through the first surface of the beam splitter and wherein the mirror can oscillate about at least one oscillation axis to scan the primary light beam; wherein the optical device further comprises a photodiode which is configured to receive the secondary light beam and to detect one or more characteristics of the secondary light beam, wherein the photodiode is configured to be offset from being parallel to at least one of the first surface or second surface of the a beam splitter, to reduce the amount of parasitic light which is directed to the mirror. There is further provided a corresponding method of projecting an image.
Abstract:
A method for fabricating a micromirror in a wafer, including the steps of: depositing and etching layers forming two arms; etching the wafer such that in the back face only a thin portion of the wafer remains in the region of formation of the micromirror and the arms; performing an anisotropic etch, such that the thin portion remains only in the areas of the micromirror and the arms; and performing an isotropic etch to remove the thin portions under the arms, the etching step for forming the arms being performed following their shape and so as to form holes traversing the arms, the holes being positioned at edges of the region separating the micromirror and the wafer on both the side of the micromirror and the side of the portions of the wafer remaining after the anisotropic etching step. The invention also concerns the micromirror.
Abstract:
A method for fabricating a micromirror in a wafer, including the steps of: depositing and etching layers forming two arms; etching the wafer such that in the back face only a thin portion of the wafer remains in the region of formation of the micromirror and the arms; performing an anisotropic etch, such that the thin portion remains only in the areas of the micromirror and the arms; and performing an isotropic etch to remove the thin portions under the arms, the etching step for forming the arms being performed following their shape and so as to form holes traversing the arms, the holes being positioned at edges of the region separating the micromirror and the wafer on both the side of the micromirror and the side of the portions of the wafer remaining after the anisotropic etching step. The invention also concerns the micromirror.
Abstract:
According to the present invention there is provided a method of manufacturing a projecting device comprising the steps of fixing the positions of a red light source, green light source and blue light source so that the light sources are immovable; providing a mirror which is configured to oscillate such that it can scan light it receives across a display screen; positioning an optical component, which is configured to deflect light, such that it can receive red, green and blue light beams outputted from the red, green and blue light sources respectively; adjusting the optical component such that the optical component compensates for variation between the light sources, in the direction in which the red, green and blue light beams are output from the red, green and blue light sources, so that each of the red, green and blue light beams are directed to the same point on the display screen. There is further provided a corresponding projection device.
Abstract:
A microelectronic pressure sensor comprises a MOSFET transistor adapted with a mobile gate and a cavity between the mobile gate and a substrate. The sensor includes a gate actuator configured to move mobile gate in response to a pressure being exercised. A fingerprint recognition system includes a matrix of such sensors.
Abstract:
The present invention provides a projection system (10), preferably for a head-up display e.g. on board a vehicle, comprising a laser source (1), a diffuser (3) and telecentric optics (2) disposed between the laser and the diffuser so that the telecentric optics outputs parallel rays to the diffuser, the diffused light being thus independent from the incidence angle; each pixel of the projected image has the same brightness, regardless of the angle or of the position from which it is viewed.