公开(公告)号：US20220347799A1

公开(公告)日：2022-11-03

申请号：US17812352

申请日：2022-07-13

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Chuantong CHEN ,  Toshiyuki ISHINA ,  Seungjun NOH ,  Chanyang CHOE

IPC: B23K35/30 ,  H01L23/00 ,  B32B15/01

Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

公开(公告)号：US20240278321A1

公开(公告)日：2024-08-22

申请号：US18643068

申请日：2024-04-23

Applicant: TOPPAN Holdings Inc. ,  OSAKA UNIVERSITY

Inventor： Takuya SEKIGUCHI ,  Chuantong CHEN ,  Katsuaki SUGANUMA

IPC: B22F7/06 ,  B22F1/00 ,  B22F1/052 ,  B22F1/054 ,  B22F3/10 ,  B22F3/24 ,  B22F9/24

CPC classification number: B22F7/062 ,  B22F1/052 ,  B22F1/056 ,  B22F1/09 ,  B22F3/10 ,  B22F9/24 ,  B22F2003/248 ,  B22F2301/10 ,  B22F2301/255 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00

Abstract: A sintered material containing silver particles, copper particles, a nitrogen-containing compound, and a reducing agent, in which a primary particle diameter of the silver particles is 200 nm or less, and a volume-based 50% cumulative particle diameter of the copper particles, as measured by laser diffraction/scattering particle diameter distribution measurement, is 1 μm or more.

公开(公告)号：US20220230988A1

公开(公告)日：2022-07-21

申请号：US17595826

申请日：2020-05-28

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Chuantong CHEN ,  Zheng ZHANG

IPC: H01L23/00

Abstract: A bonding structure production method for producing a bonding structure (100) includes at least bonding a semiconductor element (30) and a substrate (10) using a silver paste. The substrate (10) includes a die attachment portion (12) to which the semiconductor element (30) is to be bonded. The die attachment portion (12) includes an alumina layer (16) serving as a surface layer on a bonding side of the die attachment portion (12) to which the semiconductor element (30) is to be bonded. The silver paste contains a solvent and silver particles with a residual strain measured by X-ray diffractometry of at least 5.0%. Preferably, the silver particles have a volume-based 50% cumulative diameter of at least 100 nm and no greater than 50 μm.

公开(公告)号：US20200039007A1

公开(公告)日：2020-02-06

申请号：US16487924

申请日：2018-02-23

Applicant: OSAKA UNIVERSITY

Inventor： Katsuaki SUGANUMA ,  Chuantong CHEN ,  Toshiyuki ISHINA ,  Seungjun NOH ,  Chanyang CHOE

IPC: B23K35/30 ,  H01L23/00

Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).