公开(公告)号：US20140247563A1

公开(公告)日：2014-09-04

申请号：US14355258

申请日：2012-10-10

Applicant: OSRAM GmbH

Inventor： MingTao Wang ,  Guoan He ,  LiBo Wu

IPC: H05K7/02 ,  H05K7/20 ,  H05K13/00

CPC classification number: H05K7/02 ,  F21K9/23 ,  F21V19/003 ,  F21Y2115/10 ,  H05K7/2039 ,  H05K7/20463 ,  H05K13/00 ,  Y10T29/49124

Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Abstract translation: 驱动器组件包括驱动器壳体和驱动器，所述驱动器包括至少一个第一部分和第二部分，所述第一部分具有比所述第二部分更低的耐热性，其中所述驱动器壳体包括至少一个第一腔，用于至少 部分地容纳所述第一部分和用于容纳所述第二部分的第二空腔，并且将灌封材料封装到所述第一腔体中以包封所述第一部分。

公开(公告)号：US09392716B2

公开(公告)日：2016-07-12

申请号：US14355258

申请日：2012-10-10

Applicant: OSRAM GmbH

Inventor： MingTao Wang ,  Guoan He ,  LiBo Wu

IPC: H05K7/20 ,  H05K7/02 ,  F21K99/00 ,  H05K13/00 ,  F21V19/00 ,  F21Y101/02

CPC classification number: H05K7/02 ,  F21K9/23 ,  F21V19/003 ,  F21Y2115/10 ,  H05K7/2039 ,  H05K7/20463 ,  H05K13/00 ,  Y10T29/49124

Abstract: A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.

Abstract translation: 驱动器组件包括驱动器壳体和驱动器，所述驱动器包括至少一个第一部分和第二部分，所述第一部分具有比所述第二部分更低的耐热性，其中所述驱动器壳体包括至少一个第一腔，用于至少 部分地容纳所述第一部分和用于容纳所述第二部分的第二空腔，并且将灌封材料封装到所述第一腔体中以包封所述第一部分。