公开(公告)号：US20160343971A1

公开(公告)日：2016-11-24

申请号：US15112517

申请日：2015-01-20

Applicant: OSRAM OLED GMBH

Inventor： Stefan Dechand ,  Sarah Seidel ,  Dieter Musa ,  Michael Popp

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32

CPC classification number: H01L51/525 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/5212 ,  H01L51/5246 ,  H01L51/56 ,  H01L2251/5361

Abstract: A light-emitting device includes a substrate having a substrate upper side, a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence includes a plurality of emission regions that emit light, current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emissionr egions of the layer sequence are arranged next to the current-conducting rails, an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass, and spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein, in a plan view of the substrate upper side, the spacers at least partly overlap with the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.

Abstract translation: 发光装置包括具有基板上侧的基板，布置在基板上侧上的层序列，并且具有至少一个有源发光有机层，其中该层序列包括发射光的多个发射区域 作为层序列的一部分的导电导轨，其中，在基板上侧的平面图中，层序列的发射极布置在导电轨道旁边，封装玻璃，其中该层 序列布置在基底和封装玻璃之间，间隔物形成为封装玻璃下侧上的高度并面向封装玻璃的层序列，其中在基底上侧的平面图中，间隔物至少部分重叠 并且间隔物防止封装玻璃与发射区域中的层序列之间的直接接触。

公开(公告)号：US09755178B2

公开(公告)日：2017-09-05

申请号：US14905836

申请日：2014-06-13

Applicant: OSRAM OLED GmbH

Inventor： Silke Scharner ,  Stefan Dechand

IPC: B05D5/12 ,  H01L51/52 ,  H01L51/00 ,  H01L51/44 ,  H05K3/12 ,  H05K3/28 ,  H01L51/56 ,  H05K1/09

CPC classification number: H01L51/5215 ,  H01L51/0022 ,  H01L51/0027 ,  H01L51/445 ,  H01L51/56 ,  H01L2251/5369 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/282 ,  H05K2201/0326 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02E10/549

Abstract: Various embodiments may relate to a method for forming a conductor path structure on an electrode surface of an electronic component. The method includes introducing electrically conductive metal particles into an insulating carrier material, producing a mixed composition by mixing the carrier material with the metal particles, applying the mixed composition to the electrode surface, separating the metal particles from the carrier material, allowing the metal particles to become attached to the electrode surface, fixing the metal particles attached to the electrode surface, and curing the carrier material.

公开(公告)号：US10756294B2

公开(公告)日：2020-08-25

申请号：US15311182

申请日：2015-04-15

Applicant: OSRAM OLED GmbH

Inventor： Michael Popp ,  Andrew Ingle ,  Christoph Kefes ,  Johannes Rosenberger ,  Stefan Dechand ,  Egbert Hoefling ,  Benjamin Claus Krummacher

IPC: H01B3/40 ,  C08G59/50 ,  H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  C08K5/101 ,  H01L27/32

Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. The first compound comprises an epoxy group and a hydroxyl group. The second compound comprises an ester group. The curing takes place at room temperature or at temperatures between 50° C. and 260° C.

公开(公告)号：US20160155981A1

公开(公告)日：2016-06-02

申请号：US14905836

申请日：2014-06-13

Applicant: OSRAM OLED GMBH

Inventor： Silke Scharner ,  Stefan Dechand

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/00

CPC classification number: H01L51/5215 ,  H01L51/0022 ,  H01L51/0027 ,  H01L51/445 ,  H01L51/56 ,  H01L2251/5369 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/282 ,  H05K2201/0326 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02E10/549

Abstract: Various embodiments may relate to a method for forming a conductor path structure on an electrode surface of an electronic component. The method includes introducing electrically conductive metal particles into an insulating carrier material, producing a mixed composition by mixing the carrier material with the metal particles, applying the mixed composition to the electrode surface, separating the metal particles from the carrier material, allowing the metal particles to become attached to the electrode surface, fixing the metal particles attached to the electrode surface, and curing the carrier material.

Abstract translation: 各种实施例可以涉及在电子部件的电极表面上形成导体路径结构的方法。 该方法包括将导电金属颗粒引入绝缘载体材料中，通过将载体材料与金属颗粒混合来制备混合组合物，将混合组合物施加到电极表面，将金属颗粒与载体材料分离，使金属颗粒 固定在电极表面上，固定附着在电极表面上的金属颗粒，并使载体材料固化。