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1.发明公开公开(公告)号：US20240341026A1
公开(公告)日：2024-10-10
申请号：US18296461
申请日：2023-04-06
申请人： WOLFSPEED, INC.
发明人： Haedong JANG , Marvin MARBELL , Jeremy FISHER
CPC分类号： H05K1/0201 , H05K1/116 , H05K1/181 , H01L25/162 , H05K2201/0326 , H05K2201/066 , H05K2201/10015
摘要： A component includes a substrate board; a thermal bridge structured and arranged on the substrate board, where the thermal bridge is configured to transfer heat from the substrate board including an area adjacent to or on a hotspot of the substrate board; where the thermal bridge is configured to transfer the heat to another location on the substrate board for removal of the heat from the substrate board; and where the thermal bridge may include silicon carbide.
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公开(公告)号：US20230199972A1
公开(公告)日：2023-06-22
申请号：US17559290
申请日：2021-12-22
CPC分类号： H05K3/385 , H05K1/05 , H05K1/09 , H05K1/0298 , H05K3/10 , H05K3/282 , H05K2201/0326 , H05K2201/0338
摘要： An oxide coating composition and a process for enhancing adhesion between a metal conducting layer and an in organic material or polymeric resin material using the oxide coating composition. The process includes the steps of applying the oxide coating composition to the metal conducting layer and bonding the inorganic material or polymeric resin material to the metal conducting layer. The oxide coating composition comprises (a) an alkali; (b) an oxidizing agent; (c) an acid; and (d) a corrosion inhibitor comprising a nitrogen heterocyclic compound;
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公开(公告)号：US20180293421A1
公开(公告)日：2018-10-11
申请号：US16008239
申请日：2018-06-14
申请人： Japan Display Inc.
发明人： Hiroshi MIZUHASHI , Gen KOIDE , Hayato KURASAWA , Toshio SOYA , Fumitaka GOTOH
IPC分类号： G06K9/00 , G02F1/1333 , G02F1/1343 , G02F1/1362 , G06F3/041 , G06F3/044 , H05K1/02 , G02F1/1368
CPC分类号： G06K9/0002 , G02F1/133345 , G02F1/13338 , G02F1/134336 , G02F1/136286 , G02F1/1368 , G02F2001/136218 , G02F2201/121 , G02F2201/123 , G06F3/0412 , G06F3/0416 , G06F3/044 , H05K1/0274 , H05K2201/0326 , H05K2201/10151
摘要： According to one embodiment, a sensor includes a first control line, a first signal line, a first detection switch, a common electrode, a first detection electrode, a first circuit and a second circuit. The common electrode is located above the first control line, the first signal line and the first detection switch, opposed to the first control line, the first signal line and the first detection switch. The first detection electrode is located above the common electrode. The first circuit and the second circuit are located under the common electrode, and are opposed to the common electrode.
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公开(公告)号：US10037960B2
公开(公告)日：2018-07-31
申请号：US15582801
申请日：2017-05-01
发明人： Arata Kishi , Hiroki Maruo
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/264 , C22C12/00 , C22C28/00 , H01L24/05 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/05609 , H01L2224/05611 , H01L2224/05686 , H01L2224/13109 , H01L2224/13113 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/81203 , H01L2224/9202 , H01L2224/92125 , H01L2924/014 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H05K1/111 , H05K1/181 , H05K3/3457 , H05K2201/0326
摘要： There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.
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公开(公告)号：US09920421B2
公开(公告)日：2018-03-20
申请号：US14101032
申请日：2013-12-09
发明人： Hans-Georg Lotz , Neil Morrison , Thomas Deppisch
IPC分类号： C23C14/08 , C23C14/14 , C23C14/34 , C23C14/56 , C23C14/58 , H01J37/34 , G06F3/044 , G06F3/041 , G03F9/00 , C23C14/35 , H05K1/02 , H05K3/00 , H05K1/03
CPC分类号： C23C14/562 , C23C14/086 , C23C14/14 , C23C14/3464 , C23C14/35 , C23C14/5873 , G03F9/7042 , G06F3/041 , G06F3/044 , G06F2203/04103 , H01J37/3405 , H05K1/028 , H05K1/0393 , H05K3/00 , H05K2201/0108 , H05K2201/0145 , H05K2201/0326 , H05K2201/10128
摘要： A process for manufacturing a transparent body for a touch screen panel is described. The process includes: depositing a first transparent layer stack over a flexible transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index; providing a transparent conductive film over the first transparent layer stack; depositing a layer of a conductive material over the transparent conductive film; providing a polymer layer over the layer of a conductive material; imprinting a pattern, e.g. a 3D pattern, on the polymer layer; etching the layer of the conductive material based upon the pattern to form conductive paths for the touch screen panel; and etching the transparent conductive film based upon the pattern to form a structured transparent conductive pattern for touch detection.
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公开(公告)号：US09904385B2
公开(公告)日：2018-02-27
申请号：US15096543
申请日：2016-04-12
发明人： Akira Hirai , Mikiya Itakura , Dong Ho Lee
CPC分类号： G06F3/041 , G06F3/044 , G06F2203/04103 , H05K1/117 , H05K3/1275 , H05K3/18 , H05K3/243 , H05K3/244 , H05K3/42 , H05K2201/0108 , H05K2201/0326 , H05K2201/0949 , H05K2203/0361 , H05K2203/0574 , Y10T29/49155 , Y10T29/49165
摘要： A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel includes a plurality of sensing electrodes arranged in the touch active area on an upper surface and a lower surface of the film substrate, and outer lines arranged in the non-touch active area on the upper and the lower surfaces of the film substrate. The outer lines are connected to the sensing electrodes along one of a first direction and a second direction, and the outer lines include a transparent electrode layer and a plating layer on the transparent electrode layer.
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公开(公告)号：US20180047478A1
公开(公告)日：2018-02-15
申请号：US15792452
申请日：2017-10-24
发明人： Yui ABE , Yoshihiro TAGUCHI , Mitsuo BITO , Yoshiyuki ASABE , Yasuyuki KITAMURA , Tomoyuki YAMAI , Koji OGUMA , Tomofumi OBA
IPC分类号： H01B5/14 , B82Y30/00 , H05K1/09 , C23C14/34 , H01L51/00 , H01L31/18 , H01B1/02 , H05K3/38 , H01L31/0224 , H01L51/52 , B82Y40/00 , H01L51/10 , H01L51/44
CPC分类号： H01B5/14 , B82Y30/00 , B82Y40/00 , C23C14/34 , H01B1/02 , H01L31/0224 , H01L31/022466 , H01L31/1884 , H01L51/0021 , H01L51/102 , H01L51/442 , H01L51/5206 , H05K1/09 , H05K3/388 , H05K2201/0108 , H05K2201/0326 , H05K2201/0338 , H05K2201/10128 , Y02E10/50 , Y10T428/31663 , Y10T428/31678
摘要： A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. Preferably, the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film.
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公开(公告)号：US20170345782A1
公开(公告)日：2017-11-30
申请号：US15582801
申请日：2017-05-01
发明人： ARATA KISHI , HIROKI MARUO
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/264 , C22C12/00 , C22C28/00 , H01L24/05 , H01L24/11 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/05609 , H01L2224/05611 , H01L2224/05686 , H01L2224/13109 , H01L2224/13113 , H01L2224/16227 , H01L2224/2919 , H01L2224/73204 , H01L2224/81203 , H01L2224/9202 , H01L2224/92125 , H01L2924/014 , H01L2924/0543 , H01L2924/0544 , H01L2924/0549 , H05K1/111 , H05K1/181 , H05K3/3457 , H05K2201/0326
摘要： There is provided a connection structure of a circuit member including: a first circuit member having a first main surface provided with a first electrode; a second circuit member having a second main surface provided with a second electrode; and a joining portion which is interposed between the first main surface and the second main surface, in which the joining portion has a solder portion which electrically connects the first electrode and the second electrode to each other, in which the solder portion contains a bismuth-indium alloy, and in which an amount of bismuth contained in the bismuth-indium alloy exceeds 20% by mass and is equal to or less than 80% by mass.
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9.发明授权公开(公告)号：US09693452B2
公开(公告)日：2017-06-27
申请号：US13536201
申请日：2012-06-28
CPC分类号： H05K1/09 , G06F1/1626 , G06F1/1656 , G06F3/041 , G06F2203/04102 , G06F2203/04103 , H04M1/0202 , H04M2250/22 , H05K1/028 , H05K2201/0326 , H05K2201/0391 , H05K2201/0979 , Y10T29/4913
摘要： An apparatus including a substrate; at least one conductive path extending over the substrate and including a first portion of indium tin oxide connected in electrical series to a second portion of a different conductor.
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公开(公告)号：US20170164471A1
公开(公告)日：2017-06-08
申请号：US15209461
申请日：2016-07-13
发明人： Kyoung Chun KWEON
CPC分类号： H05K1/09 , G06F3/041 , G06F3/044 , G06F2203/04103 , H05K1/0274 , H05K3/06 , H05K2201/0326
摘要： A transparent electrode panel may include a first substrate, and a plurality of first transparent electrodes positioned on the first substrate and including first and second electrodes, wherein the first electrode is positioned on the first substrate and is made of silver or copper, and the second electrode is positioned on the first electrode and is made of an indium tin oxide or a fluorine-doped tin oxide.
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