公开(公告)号：US09922907B2

公开(公告)日：2018-03-20

申请号：US15327009

申请日：2015-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  MIchael Zitzlsperger ,  Christian Ziereis ,  Stefan Gruber

IPC: H01L23/495 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/48

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49113

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.