公开(公告)号：US12018806B2

公开(公告)日：2024-06-25

申请号：US17768698

申请日：2020-12-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Clemens Hofmann ,  Daniel Richter

IPC: F21S41/148 ,  F21S41/151 ,  F21S41/19 ,  F21S45/47 ,  F21Y107/90

CPC classification number: F21S41/192 ,  F21S41/148 ,  F21S41/151 ,  F21S45/47 ,  F21Y2107/90

Abstract: The disclosure relates to a halogen lamp replacement, in particular for car headlights, having a carrier plate which is covered on both main surfaces by structured electrically conductive layers, to which at least one respective light-emitting component, in particular at least one respective light-emitting-diode chip, is attached, the carrier plate being designed to dissipate heat generated by the light-emitting components to a heat sink formed by a coupling structure.

公开(公告)号：US11799048B2

公开(公告)日：2023-10-24

申请号：US17274312

申请日：2019-10-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Luca Haiberger

IPC: H01L31/173 ,  A61B5/00 ,  H01L31/0203 ,  H01L31/0216

CPC classification number: H01L31/173 ,  A61B5/0059 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/02165

Abstract: In an embodiment an optoelectronic sensor includes a radiation-emitting semiconductor region, a radiation-detecting semiconductor region, a first polarization filter arranged above the radiation-emitting semiconductor region and including a first polarization direction and a second polarization filter arranged above the radiation-detecting semiconductor region and including a second polarization direction, wherein the first polarization direction and the second polarization direction are perpendicular to each other, wherein a radiation-reflecting or radiation-absorbing layer is arranged on side flanks of the radiation-emitting semiconductor region and/or the radiation-detecting semiconductor region and/or the first polarization filter and/or the second polarization filter.

公开(公告)号：US20220367422A1

公开(公告)日：2022-11-17

申请号：US17630109

申请日：2020-07-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Gunnar Petersen ,  Daniel Richter

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62

Abstract: In an embodiment a method includes providing a moldable substrate, applying at least one semiconductor chip to a first main surface of the moldable substrate, introducing the semiconductor chip into the moldable substrate by deforming the moldable substrate such that the semiconductor chip is embedded into the moldable substrate proceeding from the first main surface, wherein at least one electrical contact of the semiconductor chip is freely accessible from an outside, wherein the semiconductor chip is a radiation-emitting flip-chip, and wherein a radiation exit surface of the flip-chip is free of electrical contacts, providing a carrier having at least one electrical connection location on a first main surface and applying the carrier to the first main surface of the moldable substrate after introducing the semiconductor chip into the moldable substrate such that the at least one electrical contact of the semiconductor chip is electrically contacted with the electrical connection location.

公开(公告)号：US20180287026A1

公开(公告)日：2018-10-04

申请号：US15765836

申请日：2016-10-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter

IPC: H01L33/62 ,  H01L33/48 ,  G02B6/42

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip, wherein the semiconductor chip is arranged on a leadframe section, the leadframe section includes a stiffening structure projecting away laterally from the leadframe section, and the lead-frame section, the stiffening structure and the semiconductor chip are embedded in an electrically insulating housing.

公开(公告)号：US20180096861A1

公开(公告)日：2018-04-05

申请号：US15573651

申请日：2016-05-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Brendan Holland

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L33/62

CPC classification number: H01L21/4839 ,  H01L21/4828 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49861 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/27013 ,  H01L2933/0033

Abstract: A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

公开(公告)号：US11688332B2

公开(公告)日：2023-06-27

申请号：US17636118

申请日：2020-08-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Marcel Severin

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2310/08 ,  G09G2320/0242 ,  G09G2320/0257 ,  G09G2330/021

Abstract: A control method includes A) determining intrinsic activation times of individual semiconductor emitters of a display device. The display device includes a plurality of light-emitting semiconductor emitters with different intrinsic activation times. The method also includes B) determining and storing in each case an activation delay and/or a turn-on current change for each individual one of the semiconductor emitters. The method further includes C) energizing the individual semiconductor emitters according to the previously determined activation delay and/or turn-on current change, so that in a display mode of the display device the semiconductor emitters have equally long starting times for a light emission.

公开(公告)号：US20220102562A1

公开(公告)日：2022-03-31

申请号：US17425596

申请日：2020-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Luca Haiberger ,  Daniel Richter

IPC: H01L31/0232 ,  H01L31/173 ,  G02B6/42

Abstract: In an embodiment an optoelectronic sensor arrangement includes a carrier substrate, an illuminating device, a frequency-selective optical element and a photodetector, wherein the illuminating device and the photodetector form a stacked arrangement on or with the carrier substrate, wherein the frequency-selective optical element is arranged between the illuminating device and the photodetector, wherein the photodetector is arranged in a cavity of the carrier substrate which is covered by the illuminating device and/or the frequency-selective optical element, and wherein the frequency-selective optical element includes a divider mirror and an optical filter.

公开(公告)号：US10510935B2

公开(公告)日：2019-12-17

申请号：US15765836

申请日：2016-10-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter

IPC: H01L33/62 ,  H01L33/48 ,  G02B6/42

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip, wherein the semiconductor chip is arranged on a leadframe section, the leadframe section includes a stiffening structure projecting away laterally from the leadframe section, and the leadframe section, the stiffening structure and the semiconductor chip are embedded in an electrically insulating housing.

公开(公告)号：US09922907B2

公开(公告)日：2018-03-20

申请号：US15327009

申请日：2015-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  MIchael Zitzlsperger ,  Christian Ziereis ,  Stefan Gruber

IPC: H01L23/495 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/02 ,  H01L33/48

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49113

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

公开(公告)号：US20170179353A1

公开(公告)日：2017-06-22

申请号：US15327009

申请日：2015-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Michael Zitzlsperger ,  Christian Ziereis ,  Stefan Gruber

IPC: H01L33/62 ,  H01L33/48 ,  H01L27/02 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49113

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.