ELECTRONIC COMPONENT
    8.
    发明申请

    公开(公告)号:US20170110270A1

    公开(公告)日:2017-04-20

    申请号:US15126504

    申请日:2015-01-29

    CPC classification number: H01H13/81 H01H2203/038 H01H2203/04 H01H2207/00

    Abstract: An electronic component of the present invention includes a resin case, and a terminal that is partially exposed from the resin case. Also, a first side surface along a protruding direction of the terminal includes a first plated surface and a first non-plated surface, and the first non-plated surface extends from a part of an upper end of the first side surface to a part of a lower end of the first side surface. Moreover, the first non-plated surface includes a first region that is exposed from the resin case, and a second region that is embedded in the resin case.

Patent Agency Ranking