Abstract:
A piezoelectric device includes a substrate, a lower electrode disposed above the substrate, a lower bonding layer disposed on the lower electrode, a piezoelectric layer containing a piezoelectric material disposed on an upper surface of the lower bonding layer, and an upper electrode disposed above the piezoelectric layer. The lower bonding layer includes an electrode material portion containing an electrode material of the lower electrode and a piezoelectric material portion containing a piezoelectric material. The electrode material portion and the piezoelectric material portion interdigitate with each other in the lower bonding layer.