公开(公告)号：US20180168034A1

公开(公告)日：2018-06-14

申请号：US15577011

申请日：2016-06-22

Applicant: Panasonic Intellectual Property Management Co. Ltd.

Inventor： RYOSUKE MESHII ,  KAZUO GODA ,  TAKAHIRO SHINOHARA ,  TAKANORI AOYAGI ,  KENSAKU YAMAMOTO ,  HITOSHI YOSHIDA

IPC: H05K1/02 ,  H05K1/03 ,  G01P15/125

CPC classification number: H05K1/0298 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/092 ,  B81B2207/096 ,  G01P1/00 ,  G01P15/08 ,  G01P15/125 ,  H05K1/0306

Abstract: A wiring-buried glass substrate includes a glass substrate and a first wiring. The glass substrate includes a first surface, a second surface perpendicular to the first surface, and a third surface facing the first surface. The first wiring includes a first pillar portion and a first beam portion. The first pillar portion extends in a first direction perpendicular to the first surface of the glass substrate. The first beam portion is connected to a first surface of the first pillar portion and extends to a second direction perpendicular to a second surface of the glass substrate. The first wiring is buried in the glass substrate. The first surface of the first beam portion is exposed from a third surface of the glass substrate.