公开(公告)号：US20140148057A1

公开(公告)日：2014-05-29

申请号：US14170988

申请日：2014-02-03

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Robert E. Fransen ,  Frank M. Straka ,  Melanie M. Hagar

IPC: H01R13/6461

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R24/58 ,  H01R24/64 ,  H01R43/205 ,  H05K1/0228 ,  H05K1/0239 ,  Y10T29/4913 ,  Y10T29/49224

Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.

Abstract translation: 一种通信插座，其包括具有用于接收通信插头的孔的壳体，以及至少部分地在壳体内的电路板。 电路板包括串扰补偿元件。 多个插头接口触点连接到电路板。 所述多个插头接口触点中的至少一个包括与至少一个弹簧元件分层的接触元件。

公开(公告)号：US20150349463A1

公开(公告)日：2015-12-03

申请号：US14820652

申请日：2015-08-07

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Robert E. Fransen ,  Frank M. Straka ,  Melanie M. Hagar

IPC: H01R13/6464 ,  H01R43/20 ,  H01R24/58

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R24/58 ,  H01R24/64 ,  H01R43/205 ,  H05K1/0228 ,  H05K1/0239 ,  Y10T29/4913 ,  Y10T29/49224

Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.

Abstract translation: 一种通信插座，其包括具有用于接收通信插头的孔的壳体，以及至少部分地在壳体内的电路板。 电路板包括串扰补偿元件。 多个插头接口触点连接到电路板。 所述多个插头接口触点中的至少一个包括与至少一个弹簧元件分层的接触元件。

公开(公告)号：US09136647B2

公开(公告)日：2015-09-15

申请号：US13905994

申请日：2013-05-30

Applicant: Panduit Corp.

Inventor： Frank M. Straka ,  Melanie M. Hagar ,  Masud Bolouri-Saransar ,  Ronald A. Nordin

IPC: H01P1/00 ,  H01R24/00 ,  H01R13/6466 ,  H01R13/6469 ,  H05K1/02

CPC classification number: H01R13/6466 ,  H01F38/14 ,  H01F2038/146 ,  H01R4/2416 ,  H01R13/6469 ,  H01R13/665 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/0239 ,  H05K2201/10189

Abstract: A communication connector comprising plug interface contacts having a plurality of conductor pairs, and corresponding cable connector contacts. A printed circuit board connects the plug interface contacts to respective cable connector contacts. The printed circuit board includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.

Abstract translation: 一种通信连接器，包括具有多个导体对的插头接口触点和相应的电缆连接器触点。 印刷电路板将插头接口触点连接到相应的电缆连接器触点。 印刷电路板包括在第一导体对和第二导体对之间的电路。 电路在第一导体对的第一导体和第二导体对的第一导体之间具有第一互感耦合，第一导体对的第一导体与第二导体对的第一导体之间的第一电容耦合。 第一电容耦合与第一互感耦合大致并发。 并联电容耦合将第二导体对的第一导体连接到第二导体对的第二导体。

公开(公告)号：US09106021B2

公开(公告)日：2015-08-11

申请号：US14170988

申请日：2014-02-03

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Robert E. Fransen ,  Frank M. Straka ,  Melanie M. Hagar

IPC: H01R13/66 ,  H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H05K1/02

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R24/58 ,  H01R24/64 ,  H01R43/205 ,  H05K1/0228 ,  H05K1/0239 ,  Y10T29/4913 ,  Y10T29/49224

Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.

Abstract translation: 一种通信插座，其包括具有用于接收通信插头的孔的壳体，以及至少部分地在壳体内的电路板。 电路板包括串扰补偿元件。 多个插头接口触点连接到电路板。 所述多个插头接口触点中的至少一个包括与至少一个弹簧元件分层的接触元件。

公开(公告)号：US09825406B2

公开(公告)日：2017-11-21

申请号：US14820652

申请日：2015-08-07

Applicant: Panduit Corp.

Inventor： Satish I. Patel ,  Robert E. Fransen ,  Frank M. Straka ,  Melanie M. Hagar

IPC: H05K7/06 ,  H01R13/6464 ,  H01R24/58 ,  H01R43/20 ,  H01R13/6466 ,  H01R13/66 ,  H01R24/64 ,  H01R13/6461 ,  H05K1/02

CPC classification number: H01R13/6464 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R24/58 ,  H01R24/64 ,  H01R43/205 ,  H05K1/0228 ,  H05K1/0239 ,  Y10T29/4913 ,  Y10T29/49224

Abstract: Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.

公开(公告)号：US20140011393A1

公开(公告)日：2014-01-09

申请号：US13905994

申请日：2013-05-30

Applicant: Panduit Corp.

Inventor： Frank M. Straka ,  Melanie M. Hagar ,  Masud Bolouri-Saransar ,  Ronald A. Nordin

IPC: H01R13/6466

CPC classification number: H01R13/6466 ,  H01F38/14 ,  H01F2038/146 ,  H01R4/2416 ,  H01R13/6469 ,  H01R13/665 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/0239 ,  H05K2201/10189

Abstract: A communication connector comprising plug interface contacts having a plurality of conductor pairs, and corresponding cable connector contacts. A printed circuit board connects the plug interface contacts to respective cable connector contacts. The printed circuit board includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.

Abstract translation: 一种通信连接器，包括具有多个导体对的插头接口触点和相应的电缆连接器触点。 印刷电路板将插头接口触点连接到相应的电缆连接器触点。 印刷电路板包括在第一导体对和第二导体对之间的电路。 电路在第一导体对的第一导体和第二导体对的第一导体之间具有第一互感耦合，第一导体对的第一导体与第二导体对的第一导体之间的第一电容耦合。 第一电容耦合与第一互感耦合大致并发。 并联电容耦合将第二导体对的第一导体连接到第二导体对的第二导体。