公开(公告)号：US20240274566A1

公开(公告)日：2024-08-15

申请号：US18432081

申请日：2024-02-05

申请人： Powertech Technology Inc.

发明人： Shang-Yu Chang Chien ,  Chia-Ling Lee

IPC分类号： H01L23/00

CPC分类号： H01L24/20 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3185 ,  H01L24/19 ,  H01L23/293 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/214

摘要： A package structure includes a chip and a dielectric. The chip includes a chip connector disposed on an active surface of the chip. The dielectric is at least disposed on the active surface of the chip. The chip connector has a top surface and a side surface connected to the top surface. The dielectric does not directly cover part of the side surface close to the top surface.