公开(公告)号：US12119558B2

公开(公告)日：2024-10-15

申请号：US18174470

申请日：2023-02-24

Applicant: QUALCOMM Incorporated

Inventor： Julio Zegarra ,  Peter Lien ,  Sang-June Park ,  Darryl Sheldon Jessie ,  Alberto Cicalini ,  Sean Oak ,  Neil Burns

IPC: H01Q23/00 ,  H01Q1/48 ,  H01Q1/52 ,  H05K1/18

CPC classification number: H01Q23/00 ,  H01Q1/48 ,  H01Q1/526 ,  H05K1/189

Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US11594824B2

公开(公告)日：2023-02-28

申请号：US16825615

申请日：2020-03-20

Applicant: QUALCOMM Incorporated

Inventor： Julio Zegarra ,  Peter Lien ,  Sang-June Park ,  Darryl Sheldon Jessie ,  Alberto Cicalini ,  Sean Oak ,  Neil Burns

IPC: H01Q1/52 ,  H01Q23/00 ,  H01Q1/48 ,  H05K1/18

Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.