公开(公告)号：US10594018B2

公开(公告)日：2020-03-17

申请号：US15792999

申请日：2017-10-25

Applicant: Quanta Computer Inc.

Inventor： Hui Lin ,  Chun-I Lin ,  Hung-Ren Hsu ,  Jun-Yu Lu

IPC: H01Q1/22 ,  H05K5/02 ,  H01Q3/44 ,  G06F1/16 ,  H01Q1/50 ,  H01Q1/24

Abstract: A communications device includes a system ground plane, a signal source, a device frame, a magnetic conductive material and an antenna. The signal source is electrically coupled to the system ground plane. The device frame is perpendicular to the system ground plane. The antenna is electrically coupled to the signal source and is disposed on the device frame. The magnetic conductive material is disposed adjacent to the antenna but spaced apart by a first predetermined distance from the antenna. The magnetic line of force induced by the antenna is directed in a predetermined direction by the magnetic conductive material.

公开(公告)号：US20190044214A1

公开(公告)日：2019-02-07

申请号：US15830300

申请日：2017-12-04

Applicant: Quanta Computer Inc.

Inventor： Hui LIN ,  Chun-I Lin ,  Hung-Ren Hsu ,  Jun-Yu Lu

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/40

CPC classification number: H01Q1/2258 ,  H01Q1/243 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q9/30 ,  H01Q21/28

Abstract: A communications device includes a ground plane, a signal source, a filling material and an antenna. The signal source is electrically connected to the ground plane. The antenna has a predetermined metal pattern and is coupled to the signal source. The filling material is a non-conductive material and the filling material and the predetermined metal pattern are bonded heterogeneously via a surface-mount technology.

公开(公告)号：US10411324B2

公开(公告)日：2019-09-10

申请号：US15830300

申请日：2017-12-04

Applicant: Quanta Computer Inc.

Inventor： Hui Lin ,  Chun-I Lin ,  Hung-Ren Hsu ,  Jun-Yu Lu

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q9/30 ,  H01Q21/28

Abstract: A communications device includes a ground plane, a signal source, a filling material and an antenna. The signal source is electrically connected to the ground plane. The antenna has a predetermined metal pattern and is coupled to the signal source. The filling material is a non-conductive material and the filling material and the predetermined metal pattern are bonded heterogeneously via a surface-mount technology.

公开(公告)号：US11038271B2

公开(公告)日：2021-06-15

申请号：US16710398

申请日：2019-12-11

Applicant: Quanta Computer Inc.

Inventor： Jun-Yu Lu ,  Chun-I Lin ,  Hui Lin

IPC: H01Q1/24 ,  H01Q5/328 ,  H01Q9/04 ,  H01Q1/48

Abstract: A communication device includes a ground metal element and an antenna element. The antenna element includes a first metal element, a second metal element, a third metal element, a first capacitive element, a second capacitive element, an inductive element, and a signal feeding source. A first connection point of the first metal element is coupled through the first capacitive element to the third metal element. A second connection point of the first metal element is coupled through the second capacitive element to the ground metal element. A third connection point of the second metal element is coupled through the inductive element to the third metal element. A shorting end of the third metal element is coupled to the ground metal element. The signal feeding source is coupled between the first metal element and the third metal element or the ground metal element.