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公开(公告)号：US11864341B1
公开(公告)日：2024-01-02
申请号：US17846776
申请日：2022-06-22
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Wei-Ju Chen
CPC classification number: H05K7/20145 , H05K5/0213 , H05K5/0226 , H05K5/03 , H05K7/2049 , H05K7/20409
Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
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Patent Agency Ranking
公开(公告)号：US11412638B2
公开(公告)日：2022-08-09
申请号：US17247149
申请日：2020-12-01
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Yan-Kuei Chen , Te-Chuan Wang
Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.
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公开(公告)号：US11622471B2
公开(公告)日：2023-04-04
申请号：US17304704
申请日：2021-06-24
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Tzu-Hsuan Hsu
Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.
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公开(公告)号：US11755084B2
公开(公告)日：2023-09-12
申请号：US17380845
申请日：2021-07-20
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Tzu-Hsuan Hsu
CPC classification number: G06F1/206 , H05K7/20281 , G06F2200/201
Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.
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公开(公告)号：US11431415B2
公开(公告)日：2022-08-30
申请号：US17119430
申请日：2020-12-11
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang
Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.
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公开(公告)号：US11477915B2
公开(公告)日：2022-10-18
申请号：US17149151
申请日：2021-01-14
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh Chen , Yueh-Chang Wu , Te-Chuan Wang , Tzu-Hsuan Hsu
IPC: H05K7/20
Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.
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