Isolating electric paths in semiconductor device packages

    公开(公告)号:US11270931B2

    公开(公告)日:2022-03-08

    申请号:US15893491

    申请日:2018-02-09

    Applicant: Rambus Inc.

    Abstract: Methods, systems, and apparatus for reducing power consumption or signal distortions in a semiconductor device package. The semiconductor device package includes a semiconductor device, a first electric path, a second electric path, and an isolation element in the first electric path. The second electric path is electrically connected to the first electric path and a functional unit of the device. The isolation element separates an isolated portion in the first electric path from the second electric path, where the isolation element is configured to reduce current in the isolated portion when a signal is passing through the second electric path.

    CONTROLLER TO DETECT MALFUNCTIONING ADDRESS OF MEMORY DEVICE

    公开(公告)号:US20210407619A1

    公开(公告)日:2021-12-30

    申请号:US17344155

    申请日:2021-06-10

    Applicant: Rambus Inc.

    Abstract: A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.

    Integrated circuit testing
    5.
    发明授权

    公开(公告)号:US10114073B2

    公开(公告)日:2018-10-30

    申请号:US14827983

    申请日:2015-08-17

    Applicant: RAMBUS INC.

    Inventor: Adrian E. Ong

    Abstract: Systems and methods of testing integrated circuits are disclosed. A system may include a data compression component to compress data received from an integrated circuit under test at a first clock frequency, to generate compressed data. The system may also include a data output component, operatively coupled to the data compression component, to convey the compressed data to automated testing equipment at a second clock frequency.

    ISOLATING ELECTRIC PATHS IN SEMICONDUCTOR DEVICE PACKAGES

    公开(公告)号:US20180254241A1

    公开(公告)日:2018-09-06

    申请号:US15893491

    申请日:2018-02-09

    Applicant: Rambus Inc.

    Abstract: Methods, systems, and apparatus for reducing power consumption or signal distortions in a semiconductor device package. The semiconductor device package includes a semiconductor device, a first electric path, a second electric path, and an isolation element in the first electric path. The second electric path is electrically connected to the first electric path and a functional unit of the device. The isolation element separates an isolated portion in the first electric path from the second electric path, where the isolation element is configured to reduce current in the isolated portion when a signal is passing through the second electric path.

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