Abstract:
An improved system for monitoring vibration of an electric machine is disclosed. According to one embodiment, sensors are positioned in a plane orthogonal to the motor shaft and each sensor detects vibration along at least one axis of the motor. The sensors are oriented such that the polarity of each sensor is reversed. The pairs of sensors may be used to isolate specific vibrations within the motor. According to another embodiment, a sensor may be mounted directly to the motor shaft. The sensor on the motor shaft directly detects vibrations along the motor shaft. Optionally, a second sensor may be mounted to a fixed location within the motor housing, and the combination of the sensor on the motor shaft and the sensor at a fixed location may be used to isolate specific vibrations within the motor. A motor controller may adjust operation of the motor to reduce the isolated vibration.
Abstract:
A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.
Abstract:
An improved system for monitoring vibration of an electric machine is disclosed. According to one embodiment, sensors are positioned in a plane orthogonal to the motor shaft and each sensor detects vibration along at least one axis of the motor. The sensors are oriented such that the polarity of each sensor is reversed. The pairs of sensors may be used to isolate specific vibrations within the motor. According to another embodiment, a sensor may be mounted directly to the motor shaft. The sensor on the motor shaft directly detects vibrations along the motor shaft. Optionally, a second sensor may be mounted to a fixed location within the motor housing, and the combination of the sensor on the motor shaft and the sensor at a fixed location may be used to isolate specific vibrations within the motor. A motor controller may adjust operation of the motor to reduce the isolated vibration.
Abstract:
An integrated drive motor (IDM) power distribution architecture utilizes an IDM power interface module (IPIM) to create a control voltage that is distributed to all the IDMs in a network. This power distribution may be accomplished along a hybrid cable, for example, that includes both signal conductors and power conductors. The IPIM is capable of detecting short circuits and/or overload conditions and disabling the power supply to the IDMs. Additionally, a second power supply may be utilized in the IPIM such that when the power supply to the IDMs is deactivated, the IPIM may remain functional, for example, to report one or more fault conditions to the user. Additionally, this reporting of fault status may be accomplished via a user display integrated with or coupled to the IPIM.
Abstract:
An integrated drive motor (IDM) power distribution architecture utilizes an IDM power interface module (IPIM) to create a control voltage that is distributed to all the IDMs in a network. This power distribution may be accomplished along a hybrid cable, for example, that includes both signal conductors and power conductors. The IPIM is capable of detecting short circuits and/or overload conditions and disabling the power supply to the IDMs. Additionally, a second power supply may be utilized in the IPIM such that when the power supply to the IDMs is deactivated, the IPIM may remain functional, for example, to report one or more fault conditions to the user. Additionally, this reporting of fault status may be accomplished via a user display integrated with or coupled to the IPIM.
Abstract:
An integrated drive motor (IDM) power distribution architecture utilizes an IDM power interface module (IPIM) to create a control voltage that is distributed to all the IDMs in a network. This power distribution may be accomplished along a hybrid cable, for example, that includes both signal conductors and power conductors. The IPIM is capable of detecting short circuits and/or overload conditions and disabling the power supply to the IDMs. Additionally, a second power supply may be utilized in the IPIM such that when the power supply to the IDMs is deactivated, the IPIM may remain functional, for example, to report one or more fault conditions to the user. Additionally, this reporting of fault status may be accomplished via a user display integrated with or coupled to the IPIM.
Abstract:
A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.
Abstract:
A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.
Abstract:
A motor drive, configured to be mounted to a motor, includes improvements to input circuits configured to receive and/or transfer power within the motor drive to reduce emissions over prior art motor drives. According to a first embodiment of the invention, the motor drive includes a voltage balancing circuit which utilizes surface mount capacitors having a voltage rating of at least 2772 VDC and, preferably, of at least 5000 VDC. According to another embodiment of the invention, the power supply includes a planar transformer wherein the primary and the secondary coils are uniformly formed by traces on the circuit board.
Abstract:
A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.