公开(公告)号：US20230163042A1

公开(公告)日：2023-05-25

申请号：US17858124

申请日：2022-07-06

Applicant: Richtek Technology Corporation

Inventor： Heng-Chi Huang ,  Sheng-Yao Wu ,  Min-Shun Lo ,  Shih-Chieh Lin ,  Yong-Zhong Hu

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/96 ,  H01L24/97 ,  H01L21/568 ,  H01L21/561 ,  H01L24/11 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/3735 ,  H01L2924/30101 ,  H01L2924/30107 ,  H01L2224/95001 ,  H01L24/13 ,  H01L2224/13147 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13116 ,  H01L2224/11462 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/16235 ,  H01L2924/182

Abstract: A package structure includes: a heat dissipation substrate; at least one die, including a signal transmitting side and a heat conduction side, wherein the signal transmitting side and the heat conduction side are two opposite sides on the die, and the heat conduction side is disposed on and in contact with the heat dissipation substrate; plural metal bumps, disposed on the signal transmitting side; and a package material, encapsulating the die, a side of the heat dissipation substrate in contact with the die, and the metal bumps, wherein a portion of each metal bump is exposed to an outside of the package material.

公开(公告)号：US20230131821A1

公开(公告)日：2023-04-27

申请号：US17858117

申请日：2022-07-06

Applicant: Richtek Technology Corporation

Inventor： Heng-Chi Huang ,  Sheng-Yao Wu ,  Chi-Yung Wu ,  Yong-Zhong Hu

IPC: H01L23/495

Abstract: A heat dissipation structure, includes: a lead frame, including a high temperature pad and a low temperature pad, the high temperature pad and the low temperature pad being two portions in the lead frame which are separated from each other, wherein a high heat generation component is disposed on the high temperature pad; and a high thermal conduction element, including two sides which are respectively directly connected with the high temperature pad and the low temperature pad, to dissipate the heat energy from the high heat generation component to the low temperature pad.