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公开(公告)号:US20230163042A1
公开(公告)日:2023-05-25
申请号:US17858124
申请日:2022-07-06
Applicant: Richtek Technology Corporation
Inventor: Heng-Chi Huang , Sheng-Yao Wu , Min-Shun Lo , Shih-Chieh Lin , Yong-Zhong Hu
IPC: H01L23/367 , H01L25/065 , H01L23/00 , H01L21/56 , H01L21/48 , H01L23/31 , H01L23/373
CPC classification number: H01L23/3675 , H01L25/0655 , H01L24/16 , H01L24/96 , H01L24/97 , H01L21/568 , H01L21/561 , H01L24/11 , H01L21/4882 , H01L23/3121 , H01L23/3735 , H01L2924/30101 , H01L2924/30107 , H01L2224/95001 , H01L24/13 , H01L2224/13147 , H01L2224/13111 , H01L2224/13139 , H01L2224/13116 , H01L2224/11462 , H01L2224/1184 , H01L2224/11849 , H01L2224/16235 , H01L2924/182
Abstract: A package structure includes: a heat dissipation substrate; at least one die, including a signal transmitting side and a heat conduction side, wherein the signal transmitting side and the heat conduction side are two opposite sides on the die, and the heat conduction side is disposed on and in contact with the heat dissipation substrate; plural metal bumps, disposed on the signal transmitting side; and a package material, encapsulating the die, a side of the heat dissipation substrate in contact with the die, and the metal bumps, wherein a portion of each metal bump is exposed to an outside of the package material.
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公开(公告)号:US20240203840A1
公开(公告)日:2024-06-20
申请号:US18520789
申请日:2023-11-28
Applicant: Richtek Technology Corporation
Inventor: Shih-Chieh Lin , Min-Shun Lo , Heng-Chi Huang , Yong-Zhong Hu
IPC: H01L23/495
CPC classification number: H01L23/49544
Abstract: A lead frame includes: a die pad having a die disposing area; a plurality of lead pads located around the die pad; an outer frame, located at a periphery of the die pad and the lead pads; and at least two tie bars, respectively connected between the outer frame and two opposite sides of the die pad. At least one of the die pad and the tie bars includes a thermal deformation mitigation structure.
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