LEAD FRAME AND PACKAGE METHOD
    2.
    发明公开

    公开(公告)号:US20240203840A1

    公开(公告)日:2024-06-20

    申请号:US18520789

    申请日:2023-11-28

    CPC classification number: H01L23/49544

    Abstract: A lead frame includes: a die pad having a die disposing area; a plurality of lead pads located around the die pad; an outer frame, located at a periphery of the die pad and the lead pads; and at least two tie bars, respectively connected between the outer frame and two opposite sides of the die pad. At least one of the die pad and the tie bars includes a thermal deformation mitigation structure.

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