公开(公告)号：US4438338A

公开(公告)日：1984-03-20

申请号：US318475

申请日：1981-11-05

申请人： Robert M. Stitt ,  Neil P. Albaugh

发明人： Robert M. Stitt ,  Neil P. Albaugh

IPC分类号： G02B6/42 ,  H01L31/16 ,  H01L33/60 ,  H01L33/62 ,  G02F1/28

CPC分类号： H01L33/62 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4226 ,  H01L31/16 ,  G02B6/4239 ,  H01L2224/48091 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L33/60

摘要： Means and method is disclosed for achieving a low profile optical coupling to a module comprising an optoelectronic device together with other circuitry. Maintaining the optoelectronic device parallel to the substrate on which it and the associated circuitry are mounted enables the use of standard, well known manufacturing assembly techniques while providing electrical connection to the electric ports of said optoelectronic device. Subsequent to the electrical interconnection operation, the optoelectronic device is moved, together with its connections, to a position substantially orthogonal with the mounting substrate. Optical fiber, light coupling is utilized. The low profile of the overall module package is achieved by introducing the optical fiber in a direction generally parallel with the substrate and perpendicular to the light active surface of the optic port of the optoelectronic device. The structure and method are applicable to both hybrid integrated circuit assembly technology as well as to conventional metallic lead frames for plastic encapsulation.

摘要翻译： 公开了用于实现与包括光电子器件的模块的低剖面光耦合以及其它电路的手段和方法。 维持光电子器件平行于其上和其相关电路安装的衬底能够使用标准的众所周知的制造组装技术，同时提供与所述光电子器件的电端口的电连接。 在电互连操作之后，光电子器件与其连接一起移动到与安装衬底基本正交的位置。 使用光纤，光耦合。 整个模块封装的薄型化是通过在大致平行于衬底并垂直于光电器件的光端口的光活性表面的方向引入光纤来实现的。 该结构和方法适用于混合集成电路组装技术以及用于塑料封装的常规金属引线框架。

公开(公告)号：US4346294A

公开(公告)日：1982-08-24

申请号：US280841

申请日：1981-07-06

申请人： Neil P. Albaugh ,  Robert M. Stitt

发明人： Neil P. Albaugh ,  Robert M. Stitt

IPC分类号： G02B6/42 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  G02B5/14

CPC分类号： H01L31/0203 ,  G02B6/4202 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4248 ,  H01L2224/48091 ,  H01L33/483 ,  H01L33/62

摘要： Means and method for achieving a low profile optical coupling to a planar mounted optoelectronic device. Maintaining the optoelectronic device planar to the substrate on which it and associated circuitry are mounted enables the use of standard, well known manufacturing assembly techniques while providing electrical connection to the electric ports of said optoelectronic device. Optical fiber, light coupling is utilized. The low profile of the overall package is achieved by introducing the optical fiber on a plane which is generally parallel to the light-active surface of the optic port of said optoelectronic device. Actual optical coupling is achieved by introducing a smooth radius bend in the optical fiber so as to bring the fiber and the light-active surface of the optoelectronic device into generally orthogonal relationship. A glass-to-metal seal is provided where the optic fiber enters the package so as to provide a hermetic seal. Further mechanical and environmental support is provided by encapsulating the assembly, within its package, in an encapsulating medium having an index of refraction essentially matching that of the core of the optical fiber and the optic port of said optoelectronic device so as to reduce the possibility of reflective losses at the juncture of the fiber and said light active surface of said optic port. Efficiency and light handling ability of an optical light fiber are increased by providing a mirror-like interface along its entire length and utilizing both the central core and its cladding as light transmission media.

摘要翻译： 用于实现对平面安装的光电子器件的低调光耦合的方法和方法。 将光电子器件平面保持在其上安装有其和相关电路的衬底上能够使用标准的众所周知的制造组装技术，同时提供与所述光电器件的电端口的电连接。 使用光纤，光耦合。 通过将光纤引入大致平行于所述光电子器件的光学端口的光活性表面的平面上来实现整个封装的薄型化。 通过在光纤中引入平滑的半径弯曲以实现光电子器件的光纤和光活性表面大致正交的关系来实现实际光耦合。 提供玻璃 - 金属密封件，其中光纤进入封装以提供密封。 通过将组件封装在其封装内的封装介质中，其具有基本上与光纤的芯部和所述光电子器件的光口基本上匹配的折射率的封装介质来提供进一步的机械和环境支持，以便减少 在所述光纤端口处的反射损耗和所述光端口的所述光活性表面。 通过在其整个长度上提供镜状界面并利用中心纤芯和其包层作为光传输介质来增加光纤光纤的效率和光处理能力。

公开(公告)号：US4641105A

公开(公告)日：1987-02-03

申请号：US784992

申请日：1985-10-07

申请人： Neil P. Albaugh ,  Gordon R. Kane

发明人： Neil P. Albaugh ,  Gordon R. Kane

IPC分类号： H03F3/45

CPC分类号： H03F3/45968 ,  H03F2200/261 ,  H03F2200/81

摘要： In a circuit including a differential amplifier, a switching device is coupled to the input terminals of the differential amplifier for periodically applying signals thereto. A second switching device is coupled to the output terminals of the differential amplifier and is synchronized with the switching device coupled to the input terminal. By providing an output signal that is constructed from signals amplified in an inverted and non-inverted mode of the differential amplifier, sources of noise and drift-related errors can be minimized.

摘要翻译： 在包括差分放大器的电路中，开关器件耦合到差分放大器的输入端，用于周期性地向其施加信号。 第二开关器件耦合到差分放大器的输出端，并与耦合到输入端的开关器件同步。 通过提供由差分放大器的反相和非反相模式放大的信号构成的输出信号，可以使噪声源和漂移相关误差最小化。