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    High conductivity defroster using a high power treatement
    2.
    发明申请
    High conductivity defroster using a high power treatement 审中-公开
    高导电率除霜器采用高功率处理

    公开(公告)号：US20060292938A1

    公开(公告)日：2006-12-28

    申请号：US11362490

    申请日：2006-02-24

    申请人： Robert Schwenke ,  Keith Weiss ,  Rebecca Northey

    发明人： Robert Schwenke ,  Keith Weiss ,  Rebecca Northey

    IPC分类号： H01R4/02

    CPC分类号： H05B3/84 ,  H05B2203/017

    摘要： The present invention provides for the enhancement of the amount of heat generated in the critical viewing area of a plastic window assembly by lowering the overall resistance of a conductive heater grid and allowing a greater amount of current to pass through the grid lines, thereby, increasing resistance heating of the window. This is achieved by subjecting the heater grid to a high power treatment after forming of the window assembly that reduces the resistance of the conductive heater grid.

    摘要翻译： 本发明通过降低导电加热器网格的整体电阻并允许更大量的电流通过网格线来提高在塑料窗组件的临界观察区域中产生的热量，从而增加 电阻加热的窗户。 这是通过在形成窗组件之后对加热器格栅进行高功率处理来实现的，该窗组件降低了导电加热器网格的电阻。

    Window defroster assembly with light control
    3.
    发明申请
    Window defroster assembly with light control 审中-公开
    窗户除霜器装配与灯光控制

    公开(公告)号：US20080028697A1

    公开(公告)日：2008-02-07

    申请号：US11499454

    申请日：2006-08-04

    申请人： Chengtao Li ,  Wilfried Hedderich ,  Keith D. Weiss ,  Rebecca Northey

    发明人： Chengtao Li ,  Wilfried Hedderich ,  Keith D. Weiss ,  Rebecca Northey

    IPC分类号： A47L1/16

    CPC分类号： B32B27/08 ,  H05B3/86 ,  H05B2203/013 ,  H05B2214/04

    摘要： A window defrost assembly having a substrate, a polycarbonate film adjacent to the substrate, a heater grid located between the substrate and the polycarbonate film, and a light control layer located between the polycarbonate film and the heater grid. The heater grid includes first and second bus bars and a plurality of grid lines extending between and connecting to the first and second bus bars.

    摘要翻译： 具有基板，与基板相邻的聚碳酸酯膜，位于基板和聚碳酸酯膜之间的加热器格栅以及位于聚碳酸酯膜和加热器格栅之间的光控制层的窗口除霜组件。 加热器格栅包括第一和第二母线以及在第一和第二母线之间延伸并连接到第一和第二母线的多个栅格线。

    Electrically stable copper filled electrically conductive adhesive
    4.
    发明申请
    Electrically stable copper filled electrically conductive adhesive 有权
    电稳定铜填充导电胶

    公开(公告)号：US20060197065A1

    公开(公告)日：2006-09-07

    申请号：US11072193

    申请日：2005-03-04

    申请人： Michael Gaynes ,  Jeffrey Gelorme ,  Luis Matienzo ,  Rebecca Northey ,  Michael Vincent

    发明人： Michael Gaynes ,  Jeffrey Gelorme ,  Luis Matienzo ,  Rebecca Northey ,  Michael Vincent

    IPC分类号： B32B3/00

    CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

    摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims. 37 CFR §1.72(b).

    摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。 37 CFR§1.72（b）。