公开(公告)号：US20200176271A1

公开(公告)日：2020-06-04

申请号：US16684817

申请日：2019-11-15

Applicant: Rohm Co., Ltd.

Inventor： Kentaro NASU ,  Kanako DEGUCHI

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A method for manufacturing a semiconductor device includes preparing a lead frame, mounting a semiconductor element on an obverse face of the lead frame, forming a sealing resin covering the semiconductor element, forming a groove on a reverse face of the lead frame, and removing a portion of the lead frame and a portion of the sealing resin along a disposal region that is narrower than the groove and entirely overlaps with the groove. The preparing of the lead frame includes forming at least one recess located in the disposal region and having an end that is open in the thickness direction. The forming of the groove includes exposing the recess on a side of the reverse face of the lead frame. The removing is performed with reference to the recess.

公开(公告)号：US20220084912A1

公开(公告)日：2022-03-17

申请号：US17425212

申请日：2020-02-07

Applicant: ASE JAPAN CO., LTD. ,  ROHM CO., LTD.

Inventor： Susumu FUKUI ,  Takaki TAKAHASHI ,  Kanako DEGUCHI ,  Kentaro NASU

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes a first lead, a semiconductor element, a sealing resin, a first plating layer, and a second plating layer. The first lead has a first obverse surface and a first reverse surface facing opposite from each other in a thickness direction and a first recess recessed from the first reverse surface toward the first obverse surface. The semiconductor element is mounted on the first obverse surface. The sealing resin covers the semiconductor element. The first plating layer is formed in contact with the first obverse surface and the first reverse surface. The first recess is exposed from the sealing resin. The first plating layer includes a first portion covering the first reverse surface. The second plating layer is formed in contact with the first recess and the first portion.

公开(公告)号：US20190304969A1

公开(公告)日：2019-10-03

申请号：US16357962

申请日：2019-03-19

Applicant: ROHM CO., LTD.

Inventor： Akihiko TSUBAKI ,  Kanako DEGUCHI

IPC: H01L27/06 ,  H01L27/02 ,  H01L49/02 ,  H01L29/732 ,  H01L29/861

Abstract: The present disclosure provides a semiconductor device that prevents a resistor component connected in series with a base electrode from the electrostatic damage. A semiconductor device includes, a collector layer, which is a first conductivity type semiconductor, a base layer, which is a second conductivity type semiconductor and connected with the collector layer, an emitter layer, which is the first conductivity type semiconductor and connected with the base layer, a first electrode, electrically connected to the base layer, a first resistor component, connected in series with the first electrode in a conductive path connecting the first electrode and the base layer, a second electrode, electrically connected to the emitter layer and the first resistor component; and a protection component, connected to the first electrode in parallel with the first resistor component, wherein the protection component comprises a pair of diodes formed by a pn junction and by a way of making both ends of the conductive path into a same polarity.