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公开(公告)号：US20210108324A1
公开(公告)日：2021-04-15
申请号：US16653216
申请日：2019-10-15
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Jamie Y.C. Chen , Michael Lipschutz , Miguel A. Rodriguez , Kin Cheung Lo
IPC: C25D3/64
Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.
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公开(公告)号：US20210172082A1
公开(公告)日：2021-06-10
申请号：US16708783
申请日：2019-12-10
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Miguel A. Rodriguez , Michael Lipschutz , Jamie Y.C. Chen , Youngmin Yoon
Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.
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公开(公告)号：US20220307149A1
公开(公告)日：2022-09-29
申请号：US17592056
申请日：2022-02-03
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Youngmin Yoon , Miguel A. Rodriguez , Michael Lipschutz , Jamie Y. C. Chen , Kristen Griffin
IPC: C25D3/46
Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.
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公开(公告)号：US11434577B2
公开(公告)日：2022-09-06
申请号：US17008691
申请日：2020-09-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Miguel A. Rodriguez , Youngmin Yoon , Michael Lipschutz , Jamie Y. C. Chen
Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.
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Patent Agency Ranking
公开(公告)号：US11242609B2
公开(公告)日：2022-02-08
申请号：US16653216
申请日：2019-10-15
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Jamie Y. C. Chen , Michael Lipschutz , Miguel A. Rodriguez , Kin Cheung Lo
IPC: C25D3/64
Abstract: Silver-nickel alloy electroplating compositions and methods enable electroplating silver rich silver-nickel deposits which are bright, uniform and have a relatively low coefficient of friction. The binary silver-nickel alloy is deposited from an aqueous acid silver-nickel alloy electroplating composition. The aqueous acid silver-nickel alloy electroplating composition includes thiol compounds which shift the reduction potential of silver ions toward the reduction potential of nickel ions such that a silver rich binary silver-nickel layer is deposited on a substrate.
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公开(公告)号：US20210115582A1
公开(公告)日：2021-04-22
申请号：US17008691
申请日：2020-09-01
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Miguel A. Rodriguez , Youngmin Yoon , Michael Lipschutz , Jamie Y.C. Chen
Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.
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7.发明公开公开(公告)号：US20230160085A1
公开(公告)日：2023-05-25
申请号：US18153099
申请日：2023-01-11
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Youngmin Yoon , Miguel A. Rodriguez , Michael Lipschutz , Jamie Y. C. Chen , Kristen Griffin
IPC: C25D3/46
CPC classification number: C25D3/46
Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.
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公开(公告)号：US11578418B2
公开(公告)日：2023-02-14
申请号：US17592056
申请日：2022-02-03
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Youngmin Yoon , Miguel A. Rodriguez , Michael Lipschutz , Jamie Y. C. Chen , Kristen Griffin
IPC: C25D3/46
Abstract: Silver electroplating compositions deposit silver with low coefficients of friction on substrates, such as nickel, copper and copper alloys. The silver deposits have coefficients of friction of less than or equal to 1 in contrast to many conventional silver deposits which typically have coefficients of friction greater than 1, such as 1.5. The silver deposits also have improved wear resistance in contrast to silver deposited from many conventional silver electroplating baths. The low coefficients of friction and improved wear resistance of silver deposited from the silver electroplating compositions is especially suitable for connectors and electronics finishes. Preferably, the silver electroplating compositions are cyanide-free silver electroplating compositions.
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公开(公告)号：US20220112619A1
公开(公告)日：2022-04-14
申请号：US17556037
申请日：2021-12-20
Applicant: Rohm and Haas Electronic Materials LLC
Inventor： Miguel A. Rodriguez , Michael Lipschutz , Jamie Y.C. Chen , Youngmin Yoon
Abstract: Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.
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