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公开(公告)号：US20240154329A1
公开(公告)日：2024-05-09
申请号：US18387821
申请日：2023-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongwan SHIM , Bumhee BAE , Jeongnam CHEON , Junhwa CHOI
CPC classification number: H01R12/716 , H01R12/613 , H01R12/62 , H01R12/775 , H01R12/777
Abstract: An electronic device includes a housing and a connector disposed in the housing. The connector includes a case forming an outer surface of the connector and having an opening formed in at least a portion of the outer surface and a printed circuit board disposed in the case and including a first layer where a plurality of first pins are disposed, a second layer where a plurality of second pins are disposed, and a ground layer disposed between the first layer and the second layer and disposed to maintain a substantially constant distance from the first layer and the second layer. The plurality of first pins includes at least one first ground pin. The plurality of second pins includes at least one second ground pin. The first ground pin and the second ground pin are configured to be connected through at least one via.
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公开(公告)号：US20230084535A1
公开(公告)日：2023-03-16
申请号：US17948339
申请日：2022-09-20
Applicant: Samsung Electronics Co., LTD.
Inventor： Kwangmo YANG , Bumhee BAE , Younho KIM , Changwon JANG , Jeongnam CHEON
Abstract: An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.
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公开(公告)号：US20230083895A1
公开(公告)日：2023-03-16
申请号：US17538178
申请日：2021-11-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junwhon UHM , Hyunmo YANG , Minseok KIM , Bumhee BAE
Abstract: A glasses-type electronic device is provided. The glasses-type electronic device includes a lens frame, a camera and a display, a first wearing member extending from one end of the lens frame and including a first printed circuit board (PCB) disposed therein, a second wearing member extending from the other end of the lens frame and including a second PCB disposed therein, and a flexible PCB (FPCB) extending from the first PCB through the lens frame unit and electrically connected to the second PCB. A first wiring line of the FPCB is located in at least a portion of an uppermost layer or a lowermost layer of the FPCB, and a second wiring line of the FPCB is located in at least a portion of an inner layer of the FPCB.
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公开(公告)号：US20230130657A1
公开(公告)日：2023-04-27
申请号：US18073081
申请日：2022-12-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minseok KIM , Bumhee BAE , Jongwan SHIM , Jeongnam CHEON
IPC: H01Q9/04
Abstract: An electronic device is provided. The electronic device includes a millimeter wave (mmWave) antenna including a plurality of conductive patches, a wireless communication circuit, and a radio frequency (RF) cable electrically connecting the mmWave antenna to the wireless communication circuit. A first portion of the RF cable includes a base dielectric, a metal plate disposed on one surface of the base dielectric, and a shielding film including a first region in contact with the metal plate, a second region spaced apart from the metal plate by a first height, and a third region configured to connect the first region and the second region, at least one waveguide is formed by the second region, the third region, and a portion of the metal plate, and the wireless communication circuit transmits and/or receives RF signals corresponding to the plurality of conductive patches through the at least one waveguide.
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公开(公告)号：US20210195739A1
公开(公告)日：2021-06-24
申请号：US17133380
申请日：2020-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bumhee BAE , Sungsoo KIM , Kwangmo YANG
Abstract: An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.
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Patent Agency Ranking
公开(公告)号：US20200265971A1
公开(公告)日：2020-08-20
申请号：US16749419
申请日：2020-01-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Bumhee BAE , Youngkun KWON , Minseok KIM , Younho KIM , Changwon JANG , Jeongnam CHEON
Abstract: Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.
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公开(公告)号：US20240431020A1
公开(公告)日：2024-12-26
申请号：US18828055
申请日：2024-09-09
Applicant: Samsung Electronics Co., LTD.
Inventor： Kwangmo YANG , Bumhee BAE , Younho KIM , Changwon JANG , Jeongnam CHEON
Abstract: An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.
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公开(公告)号：US20240179230A1
公开(公告)日：2024-05-30
申请号：US18394663
申请日：2023-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bumhee BAE , Myunghoi KIM , Minseok KIM , Younho KIM , Jongwan SHIM , Kwangmo YANG , Jeongnam CHEON
CPC classification number: H04M1/0274 , H01P3/12 , H04M1/0277
Abstract: An electronic device including wires is provided. The electronic device, which includes multiple wires through which direct current (DC) power and at least one radio frequency (RF) signal are transmitted, includes an RF transmitter configured to transmit the RF signal, and a power transmitter configured to transmit the DC power. The power transmitter includes a first power conductor including a conductive material, a second power wire including a conductive material and electrically spaced apart from the first power conductor in a first direction, a power conductor disposed between the first power conductor and the second power wire in parallel with the second power wire and electrically spaced apart from the second power wire, and at least one first via electrically connecting the first power conductor and the power conductor.
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公开(公告)号：US20240073307A1
公开(公告)日：2024-02-29
申请号：US18387351
申请日：2023-11-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Bumhee BAE , Kiman KIM , Junggil KIM , Younghun SEONG , Jeongnam CHEON
CPC classification number: H04M1/0277 , H04M1/0216 , H04M1/0274 , H05K1/0253 , H05K1/189
Abstract: A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.
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公开(公告)号：US20230171881A1
公开(公告)日：2023-06-01
申请号：US18096844
申请日：2023-01-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Bumhee BAE , Younghun SEONG , Jaehoon LEE , Jeongnam CHEON
CPC classification number: H05K1/028 , H05K1/0272 , H05K1/181 , H05K2201/09063 , H05K2201/093 , H05K2201/10128 , H05K2201/10098 , G06F1/1652
Abstract: A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.
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