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公开(公告)号：US20230354504A1
公开(公告)日：2023-11-02
申请号：US17904220
申请日：2020-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bumhee BAE , Sungsoo KIM , Kwangmo YANG
CPC classification number: H05K1/0224 , H05K1/115 , H05K1/028 , H05K2201/10128 , H05K2201/09263
Abstract: An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.
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公开(公告)号：US20230112269A1
公开(公告)日：2023-04-13
申请号：US17885248
申请日：2022-08-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taegyu KIM , Yeonsik YU , Kyounghoon LEE , Kwangmo YANG
Abstract: A moving robot includes a main body; a moving module configured to move the main body; a communication device including an antenna module arranged in a highest portion within the main body and performing wireless communication with an external device; and at least one processor configured to control the moving module based on a signal received from the external device through the communication device so that the main body moves toward the external device, wherein the antenna module includes a substrate; a first antenna arranged on an upper surface of the substrate; and a plurality of second antennas arranged on the upper surface of the substrate to be at the same distance from the first antenna.
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公开(公告)号：US20230084535A1
公开(公告)日：2023-03-16
申请号：US17948339
申请日：2022-09-20
Applicant: Samsung Electronics Co., LTD.
Inventor： Kwangmo YANG , Bumhee BAE , Younho KIM , Changwon JANG , Jeongnam CHEON
Abstract: An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.
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Patent Agency Ranking
公开(公告)号：US20210195739A1
公开(公告)日：2021-06-24
申请号：US17133380
申请日：2020-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bumhee BAE , Sungsoo KIM , Kwangmo YANG
Abstract: An electronic device includes a first electric element a second electric element, and a circuit board. The circuit board is configured to deliver a signal between the first electric element and the second electric element. The circuit board includes a first portion, a second portion, and a third portion. The second and third portions extend from the first portion with the first portion therebetween. The circuit board also includes at least one signal line extending from the second portion to the third portion, a plurality of ground patterns extending from the second portion to the third portion, a plurality of first conductive vias positioned at the second portion and electrically connecting the plurality of ground patterns, and a plurality of second conductive vias positioned at the third portion and electrically connecting the plurality of ground patterns. The plurality of ground patterns include a meander form at the first portion.
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公开(公告)号：US20130082717A1
公开(公告)日：2013-04-04
申请号：US13644793
申请日：2012-10-04
Applicant: SAMSUNG ELECTRONICS CO. LTD.
Inventor： Jungmin KIM , Keonyoung SEO , Kwangmo YANG , Byeonghwan KANG , Bonghee PARK
IPC: G01R31/02
CPC classification number: G01R31/001 , G01R29/0871 , G01R31/002 , H04M1/24
Abstract: A method and an apparatus for measuring performance of an electronic device are provided. The apparatus includes an electromagnetic wave measuring device for measuring an actual level of an electromagnetic wave of an electronic device, and an analysis controller for applying a previously stored level change value to the actual level of the electromagnetic wave to compute a measured level of the electromagnetic wave. The method and the apparatus for measuring performance of an electronic device can easily measure an electromagnetic wave level of the electronic device without using a device suggested by an international standard.
Abstract translation: 提供了一种用于测量电子设备性能的方法和装置。 该装置包括用于测量电子设备的电磁波的实际电平的电磁波测量装置和用于将预先存储的电平变化值应用于电磁波的实际电平的分析控制器，以计算电磁波的测量电平 波。 用于测量电子设备性能的方法和装置可以容易地测量电子设备的电磁波水平，而不使用国际标准建议的设备。
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公开(公告)号：US20240431020A1
公开(公告)日：2024-12-26
申请号：US18828055
申请日：2024-09-09
Applicant: Samsung Electronics Co., LTD.
Inventor： Kwangmo YANG , Bumhee BAE , Younho KIM , Changwon JANG , Jeongnam CHEON
Abstract: An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.
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公开(公告)号：US20240179230A1
公开(公告)日：2024-05-30
申请号：US18394663
申请日：2023-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bumhee BAE , Myunghoi KIM , Minseok KIM , Younho KIM , Jongwan SHIM , Kwangmo YANG , Jeongnam CHEON
CPC classification number: H04M1/0274 , H01P3/12 , H04M1/0277
Abstract: An electronic device including wires is provided. The electronic device, which includes multiple wires through which direct current (DC) power and at least one radio frequency (RF) signal are transmitted, includes an RF transmitter configured to transmit the RF signal, and a power transmitter configured to transmit the DC power. The power transmitter includes a first power conductor including a conductive material, a second power wire including a conductive material and electrically spaced apart from the first power conductor in a first direction, a power conductor disposed between the first power conductor and the second power wire in parallel with the second power wire and electrically spaced apart from the second power wire, and at least one first via electrically connecting the first power conductor and the power conductor.
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公开(公告)号：US20230050295A1
公开(公告)日：2023-02-16
申请号：US17975097
申请日：2022-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinjoo KIM , Kwangmo YANG , Siho JANG
IPC: H05B6/76
Abstract: According to various embodiments of the disclosure, a microwave oven may include: a main body including a cooking chamber and a front panel; a door to the main body including a door frame corresponding to the front panel; and a shielding device connected to the door to shield electromagnetic waves leaking from the cooking chamber. The shielding device may include: a choke unit extending from the door frame and including a plurality of portions constructed by being bent at least once; and a choke covering the choke unit. The choke cover may include a first portion constructed of a first material coupled to a portion of the choke unit; and a second portion connected integrally with the first portion and constructed of a second material different from the first material.
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