公开(公告)号：US20240096851A1

公开(公告)日：2024-03-21

申请号：US18301403

申请日：2023-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Unbyoung Kang ,  Jeonggi Jin ,  Gilman Kang ,  Juil Choi ,  Dongchul Han

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/12105 ,  H01L2224/32146 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06555

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure and including a first through-electrode, a second semiconductor chip on the first semiconductor chip and including a central portion vertically overlapping the first semiconductor chip and an outer portion horizontally offset from a sidewall of the first semiconductor chip, a molding layer in contact with the first redistribution structure, the first semiconductor chip, and the second semiconductor chip, a second redistribution structure on the second semiconductor chip and the molding layer, a first vertical connection wire extending through the molding layer and extending from the first redistribution structure to the second redistribution structure, and a second vertical connection wire extending through the molding layer and extending from the first redistribution structure to the outer portion of the second semiconductor chip.

公开(公告)号：US11456273B2

公开(公告)日：2022-09-27

申请号：US16682840

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaecheol Kim ,  Gilman Kang ,  Yongdae Ha

IPC: B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K101/40

Abstract: A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.