公开(公告)号：US20180282581A1

公开(公告)日：2018-10-04

申请号：US15897261

申请日：2018-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo-sik MOON ,  Sang-hyun PARK ,  Bo-un YOON ,  Ho-young KIM ,  Se-jung PARK ,  Jae-hak LEE ,  Jin-myung HWANG

IPC: C09G1/02 ,  C09K3/14

CPC classification number: C09G1/02 ,  C09K3/1409 ,  C09K3/1463

Abstract: A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.