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公开(公告)号:US20220037328A1
公开(公告)日:2022-02-03
申请号:US17210931
申请日:2021-03-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyewon KIM , Juhyung WE , Sungmi YOON , Donghyun IM , Sangwoon LEE , Taiuk RIM , Kyosuk CHAE
IPC: H01L27/108
Abstract: A semiconductor device including a substrate including a recess; a gate insulation layer on a surface of the recess; a first gate pattern on the gate insulation layer and filling a lower portion of the recess; a second gate pattern on the first gate pattern in the recess and including a material having a work function different from a work function of the first gate pattern; a capping insulation pattern on the second gate pattern and filling an upper portion of the recess; a leakage blocking oxide layer on the gate insulation layer at an upper sidewall of the recess above an upper surface of the first gate pattern and contacting a sidewall of the capping insulation pattern; and impurity regions in the substrate and adjacent to the upper sidewall of the recess, each impurity region having a lower surface higher than the upper surface of the first gate pattern.
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公开(公告)号:US20230143124A1
公开(公告)日:2023-05-11
申请号:US17861577
申请日:2022-07-11
Inventor: Changsoo LEE , Sangwoon LEE , Yongsung KIM , Jinhong KIM , Hyungjun KIM , Jooho LEE
IPC: H01L49/02 , H01L27/108 , H01G4/008
CPC classification number: H01L28/55 , H01L27/10852 , H01G4/008 , H01L28/75
Abstract: A capacitor includes a lower electrode including a perovskite material, an upper electrode spaced apart from the lower electrode, a dielectric layer positioned between the lower electrode and the upper electrode and including a perovskite material, and a passivation layer positioned between the lower electrode and the dielectric layer and including SrxTiyO3 in which a content of Ti is greater than a content of Sr.
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公开(公告)号:US20220309216A1
公开(公告)日:2022-09-29
申请号:US17491739
申请日:2021-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangwoon LEE , Joohyun JEON , Sungjin KIM , Seunghyun KIM , Wonki ROH , Chulwoo PARK , Seongjae BYEON , Taeyoon AN , Hyoeun JUNG
IPC: G06F30/3308 , G06F30/25
Abstract: A method of modeling damages to a crystal caused by an incident particle includes obtaining particle information and crystal information; estimating energy loss of the incident particle based on the particle information and the crystal information; estimating a volume of a vacancy based on the energy loss; estimating a vacancy reaction based on the crystal information and the volume of the vacancy; and generating output data based on the vacancy reaction, the output data including quantification data of the damages.
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公开(公告)号:US20220085144A1
公开(公告)日:2022-03-17
申请号:US17209762
申请日:2021-03-23
Inventor: Changsoo LEE , Sangwoon LEE , Chan KWAK , Hyungjun KIM , Euncheol DO
IPC: H01L49/02 , H01L27/108
Abstract: Provided are a dielectric thin film, an integrated device including the same, and a method of manufacturing the dielectric thin film. The dielectric thin film includes an oxide having a perovskite-type crystal structure represented by Formula 1 below and wherein the dielectric thin film comprises 0.3 at % or less of halogen ions or sulfur ions. A2-xB3-yO10-z In Formula 1, A, B, x, y, and z are disclosed in the specification.
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