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公开(公告)号：US20220216068A1
公开(公告)日：2022-07-07
申请号：US17656695
申请日：2022-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-Ho PARK , Jin-Woo PARK , Seok Hyun LEE , Jae Gwon JANG , Gwang Jae JEON
IPC: H01L21/48 , H01L21/52 , H01L25/00 , H01L21/56 , H01L23/498
Abstract: A method for fabricating a semiconductor package, the method including: forming a. release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.
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公开(公告)号：US20230396890A1
公开(公告)日：2023-12-07
申请号：US18450629
申请日：2023-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seok Hyun LEE , Whee Woong LEE , Kyung Ah JEONG
Abstract: Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.
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公开(公告)号：US20210257223A1
公开(公告)日：2021-08-19
申请号：US17037003
申请日：2020-09-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-Ho PARK , Jin-Woo PARK , Seok Hyun LEE , Jae Gwon JANG , Gwang Jae JEON
IPC: H01L21/48 , H01L21/52 , H01L23/498 , H01L21/56 , H01L25/00
Abstract: A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.
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Patent Agency Ranking
公开(公告)号：US20230068587A1
公开(公告)日：2023-03-02
申请号：US17853205
申请日：2022-06-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yae Jung YOON , Eung Kyu KIM , Min Jun BAE , Kyoung Lim SUK , Seok Hyun LEE , Jae Gwon JANG
IPC: H01L23/498 , H01L23/00 , H01L23/31 , H01L25/18 , H01L23/053
Abstract: A semiconductor package including a passivation film, a mold layer on the passivation film, a connecting pad having a T shape, the T shape including a first portion and a second portion on the first portion, the first portion penetrating the passivation film, the second portion penetrating a part of the mold layer, a solder ball on the first portion of the connecting pad, an element on the second portion of the connecting pad, a wiring structure on the mold layer, the wiring structure including an insulating layer and a wiring pattern inside the insulating layer, and a semiconductor chip on the wiring structure may be provided.
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公开(公告)号：US20210281753A1
公开(公告)日：2021-09-09
申请号：US17328147
申请日：2021-05-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seok Hyun LEE , Whee Woong LEE , Kyung Ah JEONG
Abstract: Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.
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公开(公告)号：US20240055337A1
公开(公告)日：2024-02-15
申请号：US18309113
申请日：2023-04-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hwan Young CHOI , Seok Hyun LEE , Jung Min KO , Seok Geun AHN
IPC: H01L23/498 , H01L23/31 , H01L23/00 , H01L23/535
CPC classification number: H01L23/49816 , H01L23/3128 , H01L24/29 , H01L24/16 , H01L23/535 , H01L2224/73265 , H01L2224/32225 , H01L2924/1431
Abstract: A semiconductor package includes a first semiconductor chip having a first top surface and an opposite first bottom surface, first pads on the first top surface, each having a first width and a first height, second pads on the first top surface further outward from a center of the first semiconductor chip, each having a second width less than the first width and a second height greater than the first height. The semiconductor package further includes a second semiconductor chip having a second bottom surface which faces the first top surface and an opposite second top surface, third pads on the second bottom surface which are connected to the first pads, and fourth pads on the second bottom surface which are connected to the second pads. The second bottom surface is convex.
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公开(公告)号：US20210111163A1
公开(公告)日：2021-04-15
申请号：US16885391
申请日：2020-05-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Min Jun BAE , Dong Kyu KIM , Jin-Woo PARK , Seok Hyun LEE
IPC: H01L25/10 , H01L25/065 , H01L25/00
Abstract: A semiconductor package includes a first redistribution layer. A plurality of posts is disposed on the first redistribution layer. A semiconductor chip is disposed on the first redistribution layer between the plurality of posts. A second redistribution layer is formed on the plurality of posts and the semiconductor chip. A first memory stack is disposed on the second redistribution layer. A height of each of the plurality of posts extends from an upper surface of the first redistribution layer to a lower surface of the second redistribution layer.
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公开(公告)号：US20200221024A1
公开(公告)日：2020-07-09
申请号：US16668798
申请日：2019-10-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seok Hyun LEE , Whee Woong LEE , Kyung Ah JEONG
Abstract: Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.
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