公开(公告)号：US12054846B2

公开(公告)日：2024-08-06

申请号：US17943376

申请日：2022-09-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Taiseung Cha ,  Taewan Kang ,  Donghwan Park ,  Sunggon Kim ,  Sungkeun Lee

IPC分类号： C25D5/18 ,  C25D7/12 ,  C25D17/00 ,  C25D17/08 ,  C25D21/08 ,  C25D21/12 ,  C25D21/18

CPC分类号： C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/08 ,  C25D21/08 ,  C25D21/12 ,  C25D21/18

摘要： An electroplating apparatus includes: an electroplating bath including an anode region, in which an anode electrode is arranged, a cathode region and a membrane; a head unit including a contact ring holding a wafer and configured so that a first cathode potential is applied to the contact ring during an electroplating process; a reverse potential electrode arranged adjacent to the membrane and configured so that a second cathode potential is applied to the reverse potential electrode during the electroplating process, and a reverse cathode potential is applied to the reverse potential electrode during a rinsing process; and a power supply unit configured to apply the first cathode potential and the second cathode potential during the electroplating process, and further configured to apply the reverse cathode potential and a reverse anode potential to the anode electrode during the rinsing process.

公开(公告)号：US20230083395A1

公开(公告)日：2023-03-16

申请号：US17943376

申请日：2022-09-13

申请人： Samsung Electronics Co., Ltd.

发明人： Taiseung Cha ,  Taewan Kang ,  Donghwan Park ,  Sunggon Kim ,  Sungkeun Lee

IPC分类号： C25D5/18 ,  C25D17/00 ,  C25D17/08 ,  C25D21/08 ,  C25D21/12

摘要： An electroplating apparatus includes: an electroplating bath including an anode region, in which an anode electrode is arranged, a cathode region and a membrane; a head unit including a contact ring holding a wafer and configured so that a first cathode potential is applied to the contact ring during an electroplating process; a reverse potential electrode arranged adjacent to the membrane and configured so that a second cathode potential is applied to the reverse potential electrode during the electroplating process, and a reverse cathode potential is applied to the reverse potential electrode during a rinsing process, and a power supply unit configured to apply the first cathode potential and the second cathode potential during the electroplating process, and further configured to apply the reverse cathode potential and a reverse anode potential to the anode electrode during the rinsing process.