公开(公告)号：US11756908B2

公开(公告)日：2023-09-12

申请号：US17718639

申请日：2022-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu Lim ,  Gookmi Song ,  Sunguk Lee

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/20 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2924/3512

Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

公开(公告)号：US12176308B2

公开(公告)日：2024-12-24

申请号：US18459628

申请日：2023-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu Lim ,  Gookmi Song ,  Sunguk Lee

IPC: H01L23/00

Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.

公开(公告)号：US11264339B2

公开(公告)日：2022-03-01

申请号：US16703239

申请日：2019-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyujin Choi ,  Sunghoan Kim ,  Changeun Joo ,  Chilwoo Kwon ,  Youngkyu Lim ,  Sunguk Lee

IPC: H01L23/00 ,  H01L21/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

Abstract: The method of manufacturing a connection structure of a semiconductor chip includes: preparing a semiconductor chip having a first surface having a connection pad disposed thereon and a second surface opposing the first surface and including a passivation layer disposed on the first surface and covering the connection pad; forming an insulating layer on the first surface of the semiconductor chip, the insulating layer covering at least a portion of the passivation layer; forming a via hole penetrating through the insulating layer to expose at least a portion of the passivation layer; exposing at least a portion of the connection pad by removing the passivation layer exposed by the via hole; forming a redistribution via by filling the via hole with a conductive material; and forming a redistribution layer on the redistribution via and the insulating layer.

公开(公告)号：US11302661B2

公开(公告)日：2022-04-12

申请号：US16930517

申请日：2020-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngkyu Lim ,  Gookmi Song ,  Sunguk Lee

IPC: H01L23/00

Abstract: A package substrate may include an insulation substrate, at least one redistribution layer (RDL) and a redistribution pad. The RDL may be included in the insulation substrate. The redistribution pad may extend from the RDL. The redistribution pad may include at least one segmenting groove in a radial direction of the redistribution pad. Thus, the at least one segmenting groove in the radial direction of the redistribution pad may reduce an area of the redistribution pad. Therefore, application of physical stress to a PID disposed over the redistribution pad may be suppressed, and thus generation of cracks in the PID may be reduced. Further, spreading of the cracks toward the redistribution pad from the PID may also be suppressed, and thus reliability the semiconductor package may be improved.