ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY

    公开(公告)号:US20230008612A1

    公开(公告)日:2023-01-12

    申请号:US17855115

    申请日:2022-06-30

    Abstract: An electronic device includes: a flexible display that is configured to be deformable to a first state, in which an exposed amount of a display area of the flexible display has a first size, and a second state, in which the exposed amount of the display area is expanded in a first direction; a deformable member including a liquid-state electrode, the deformable member configured to deform in a length direction based on the flexible display transitioning between the first state and the second state; a deformation sensing circuit configured to sense a resistance component of the liquid-state electrode, the resistance component corresponding to an exposure degree of the display area; a connector member electrically connecting the deformable member and the deformation sensing circuit; a rigid member coupled to the deformable member; and a fixed structure contacting a partial area of the rigid member.

    INDUCTION HEATING COOKING APPARATUS

    公开(公告)号:US20220174793A1

    公开(公告)日:2022-06-02

    申请号:US17675867

    申请日:2022-02-18

    Abstract: An induction heating cooking apparatus includes a glass provided such that a cooking container is disposed on an upper surface thereof and a side surface thereof is exposed to the outside. The induction heating cooking apparatus also includes an operating coil positioned below the glass to inductively heat the cooking container by generating a magnetic field. The side surface includes a first surface extending from the upper surface of the glass and having a first curvature. The side surface also includes a second surface extending from the first surface and having a second curvature different from the first curvature. The side surface further includes a third surface extending from the second surface to a lower surface of the glass and having a third curvature different from the first curvature and the second curvature.

    ELECTRONIC APPARATUS COMPRISING FLEXIBLE DISPLAY

    公开(公告)号:US20230259167A1

    公开(公告)日:2023-08-17

    申请号:US18297192

    申请日:2023-04-07

    CPC classification number: G06F1/1652 G06F1/1624

    Abstract: An electronic device according to an embodiment of the disclosure includes: a first housing, a second housing coupled to one side of the first housing and configured to slide in multiple directions, and a display including a plurality of layers, and a size of a visible region of the display of a front surface of the electronic device is configured to be changed in response to a sliding operation of the second housing. The display includes a base part forming the front surface of the electronic device and configured to maintain a shape based on the second structure sliding and a rollable part extending from the base part and configured to be deformed to be flat or curved based on the sliding operation of the second housing. The plurality of layers include a panel layer, a reinforcement layer disposed on a surface of the panel layer, and a cover layer disposed on a surface of the reinforcement layer and facing the panel layer with the reinforcement layer therebetween. The cover layer includes a first portion included in the base part of the display and a second portion included in the rollable part of the display when a section of the display is viewed. The first portion and the second portion are different from each other in terms of at least one of a structure, a shape, or a property.

    WAFER PROCESSING EQUIPMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20220325953A1

    公开(公告)日:2022-10-13

    申请号:US17493346

    申请日:2021-10-04

    Abstract: A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber is provided. The fluid supply device includes a reservoir configured to change the processing fluid into a supercritical fluid state; a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device.

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