公开(公告)号：US11189675B2

公开(公告)日：2021-11-30

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kyungwoon Jang ,  Gyun Heo ,  Youngjun Moon ,  Kwangrae Jo ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L27/32 ,  H01L27/15 ,  H05B33/10 ,  H05B45/20

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.

公开(公告)号：US11362249B2

公开(公告)日：2022-06-14

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/58 ,  H01L33/48 ,  H01L33/00 ,  G09G3/32

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

公开(公告)号：US20210111324A1

公开(公告)日：2021-04-15

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  G09G3/32 ,  H01L27/15 ,  H01L33/58 ,  H01L33/00 ,  H01L33/48

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

公开(公告)号：US12205977B2

公开(公告)日：2025-01-21

申请号：US17524421

申请日：2021-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daesuck Hwang ,  Kyungwoon Jang ,  Changkyu Chung ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/15 ,  G09G3/32 ,  H01L33/00 ,  H01L25/16

Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

公开(公告)号：US20240421279A1

公开(公告)日：2024-12-19

申请号：US18813979

申请日：2024-08-23

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Changjoon LEE ,  Kyungwoon Jang ,  Yangsoo Son ,  Jeongyun Kim ,  Sungyong Min ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L25/16

Abstract: A method for repairing a display module on which light emitting diodes are arranged, includes: removing a defective light emitting diode from among the light emitting diodes from the display module; forming an elastic conductive pad on a panel electrode of the display module that is exposed as the defective light emitting diode is removed; transferring a new light emitting diode to the display module for electrical connection to the elastic conductive pad; covering the new light emitting diode and the elastic conductive pad with a protective layer; and curing the protective layer to maintain an elastic bond between the new light emitting diode and the elastic conductive pad.

公开(公告)号：US12033995B2

公开(公告)日：2024-07-09

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Gyun Heo ,  Tackmo Lee ,  Kyungwoon Jang ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L25/16 ,  G09G3/32 ,  H01L33/62

CPC classification number: H01L25/167 ,  G09G3/32 ,  H01L33/62 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2300/0452 ,  G09G2300/0842

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.