公开(公告)号：US11011500B2

公开(公告)日：2021-05-18

申请号：US16816495

申请日：2020-03-12

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Nagesh Vodrahalli ,  Shrikar Bhagath ,  Chih Yang Li ,  Srinivasan Sivaram ,  Rama Shukla

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.

公开(公告)号：US20210104495A1

公开(公告)日：2021-04-08

申请号：US16816495

申请日：2020-03-12

Applicant: SANDISK TECHNOLOGIES LLC

Inventor： Nagesh Vodrahalli ,  Shrikar Bhagath ,  Chih Yang Li ,  Srinivasan Sivaram ,  Rama Shukla

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. The semiconductor device may further include a CMOS logic circuit as part of the pair of semiconductor dies or in its own semiconductor die mounted to the pair of semiconductor dies.