公开(公告)号：US20210402687A1

公开(公告)日：2021-12-30

申请号：US17358106

申请日：2021-06-25

申请人： Seiko Epson Corporation

发明人： Kenta ANEGAWA ,  Yasuto KANAI

IPC分类号： B29C64/209 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/241 ,  B29C64/218 ,  B29C64/393

摘要： A three-dimensional shaping device includes: a plasticizing unit configured to plasticize a material to generate a plasticized material; a stage having a deposition surface on which the plasticized material is deposited; an ejection unit that has a plurality of nozzles arranged side by side along a first axis parallel to the deposition surface of the stage, and that is configured to eject the plasticized material in a continuous linear form from the plurality of nozzles toward the deposition surface; an ejection switching unit configured to individually switch between stopping and resuming ejection of the plasticized material from the plurality of nozzles; a moving unit configured to move the ejection unit with respect to the stage along a second axis that is parallel to the deposition surface of the stage and that intersects the first axis; and a control unit configured to laminate a shaping layer formed of the plasticized material on the deposited surface of the stage by controlling the plasticizing unit, the ejection switching unit, and the moving unit.

公开(公告)号：US20220379531A1

公开(公告)日：2022-12-01

申请号：US17751723

申请日：2022-05-24

申请人： Seiko Epson Corporation

发明人： Hidenobu MARUYAMA ,  Kenta ANEGAWA ,  Keisuke AKIMOTO ,  Kei YOKOTA ,  Yasuto KANAI

IPC分类号： B29C45/13 ,  B29C45/00 ,  B29C45/04 ,  B29C45/16 ,  B29C45/40

摘要： An injection molding apparatus includes a fixed die having a first gate opening and a second gate opening formed therein, a movable die configured to be clampable to the fixed die, a first injection unit that injects a first molding material into a cavity defined by the fixed die and the movable die via the first gate opening, and a second injection unit that injects a second molding material into the cavity via the second gate opening.

公开(公告)号：US20190160746A1

公开(公告)日：2019-05-30

申请号：US16204551

申请日：2018-11-29

申请人： Seiko Epson Corporation

发明人： Kenta ANEGAWA ,  Yasuto KANAI ,  Kei YOKOTA ,  Koichi SAITO

IPC分类号： B29C64/209 ,  B29C64/118 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

摘要： A molten material supplying apparatus includes: a first introduction unit introducing fiber material; a melting unit melting a thermoplastic resin into a molten material; a first flow path in which the molten material and the fiber material are distributed; and a nozzle communicating with the first flow path to feed a composite of the molten material and the fiber material. The melting unit includes: a facing section in which a communication hole communicating with the first flow path is formed, the facing section having a heater, and a flat screw which has a groove at a position facing the facing section, the flat screw being rotated to melt the thermoplastic resin into the molten material and supply the molten material into the communication hole. The first introduction unit introduces the fiber material into at least one of the communication hole and the first flow path.

公开(公告)号：US20240300155A1

公开(公告)日：2024-09-12

申请号：US18597001

申请日：2024-03-06

申请人： SEIKO EPSON CORPORATION

发明人： Masashi FUCHII ,  Yimei DING ,  Naoki IIZUKA ,  Hidenobu MARUYAMA ,  Kenta ANEGAWA ,  Yasuto KANAI

IPC分类号： B29C45/76 ,  B29C45/17 ,  B29C45/42 ,  B29C45/77 ,  B29C45/78

CPC分类号： B29C45/768 ,  B29C45/1769 ,  B29C45/42 ,  B29C45/7646 ,  B29C45/7686 ,  B29C45/77 ,  B29C45/78 ,  B29C2945/7613 ,  B29C2945/7619 ,  B29C2945/76254 ,  B29C2945/7629 ,  B29C2945/76461 ,  B29C2945/76464 ,  B29C2945/76498 ,  B29C2945/76511 ,  B29C2945/76531 ,  B29C2945/76561 ,  B29C2945/76571 ,  B29C2945/76605 ,  B29C2945/76615 ,  B29C2945/76936

摘要： An injection molding system includes a molding device, an inspection device configured to inspect a molded product and a control device that includes a storage unit, and a reception unit configured to receive a change content of a parameter included in a standard molding condition. The control device executes a first control of forming the molded product under a second molding condition in which the parameter is changed based on the change content, a second control of forming the molded product under a third molding condition in which the same parameter is changed, a third control of associating the second molding condition with an inspection result of the molded product formed under the second molding condition and storing the association, and a fourth control of associating the third molding condition with the inspection result of the molded product formed under the third molding condition and storing the association.