Substrate treating apparatus, and method of controlling the substrate treating apparatus

    公开(公告)号:US12097525B2

    公开(公告)日:2024-09-24

    申请号:US17960394

    申请日:2022-10-05

    Inventor: Cheon Su Cho

    CPC classification number: B05C11/00 B05C5/0208

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.

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