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公开(公告)号:US20230211436A1
公开(公告)日:2023-07-06
申请号:US18145245
申请日:2022-12-22
申请人: SEMES CO., LTD.
发明人: Hyo Won YANG , Hyun Yoon , Ji Hoon Jeong , Ki Hoon Choi , In Ki Jung , Won Sik Son , Tae Hee Kim
IPC分类号: B23K26/03 , G03F1/84 , G03F1/42 , G03F1/60 , B23K26/122 , B23K26/06 , B23K26/04 , B23K26/362
CPC分类号: B23K26/032 , G03F1/84 , G03F1/42 , G03F1/60 , B23K26/122 , B23K26/0648 , B23K26/043 , B23K26/362
摘要: The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.
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公开(公告)号:US12057335B2
公开(公告)日:2024-08-06
申请号:US17957428
申请日:2022-09-30
申请人: SEMES CO., LTD.
发明人: Sang Min Lee , Jin Se Park , Ki Hoon Choi
CPC分类号: H01L21/67253 , G01N1/10 , H01L21/67034
摘要: Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.
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公开(公告)号:US12011936B2
公开(公告)日:2024-06-18
申请号:US17947084
申请日:2022-09-17
申请人: SEMES CO., LTD.
发明人: Jang Mi Woo , Ki Hoon Choi , Young Hoon Jeong , Myung Jin Kim
IPC分类号: B41J25/34
CPC分类号: B41J25/34
摘要: The present disclosure provides a droplet discharging device capable of minimizing misalignment of a plurality of heads. The droplet discharging device comprises a base including a head fixing region to which a plurality of heads are fixed; a pack holder disposed on the base and including an opening penetrated by the plurality of heads installed on the base; a guide pin installed on the pack holder and protruding towards the base; a guide holder installed on the base and fastened to the guide pin; a first fastening part installed on the pack holder and protruding towards the base; and a second fastening part installed on the base and fastened to the first fastening part, wherein a lock air is supplied to one of the first fastening part and the second fastening part, thus fastening the first fastening part and the second fastening part.
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公开(公告)号:US20240075740A1
公开(公告)日:2024-03-07
申请号:US18225668
申请日:2023-07-24
申请人: SEMES CO., LTD.
发明人: Jang Mi WOO , Jin Hyuck Yang , Yong Kyu Cho , Cheon Su Cho , Ki Hoon Choi
CPC分类号: B41J2/1433 , B41J2/04563 , B41J2/04581 , B41J2/16579
摘要: An inkjet head unit capable of performing high-resolution pixel printing on a large-size substrate and a substrate treatment apparatus including the inkjet head unit are provided. The substrate treatment apparatus includes: a processing unit supporting and moving a substrate; an inkjet head unit performing pixel printing on the substrate; and a gantry unit moving the inkjet head unit over the substrate, wherein the inkjet head unit includes head packs, which include a plurality of nozzles ejecting a substrate treatment liquid onto the substrate, and a head base, in which the head packs are installed and the head packs are disposed in a single row in the head base.
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公开(公告)号:US20230213866A1
公开(公告)日:2023-07-06
申请号:US18147473
申请日:2022-12-28
申请人: SEMES CO., LTD.
发明人: Hyun YOON , Ji Hoon Jeong , Young Dae Chung , Ki Hoon Choi
CPC分类号: G03F7/70158 , G03F1/60 , G03F7/70025
摘要: The present disclosure relates to an apparatus for treating a substrate. The substrate treatment apparatus includes a support unit that supports a substrate, a liquid supply unit that supplies a liquid to the substrate supported by the support unit, and a laser unit that heats the substrate supported by the support unit, wherein the laser unit includes an oscillation unit that emits a light, and a diffraction unit that separates the light into a plurality of light bundles and irradiates the substrate supported by the support unit with an adjustment light having a profile changed from a profile of the light.
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公开(公告)号:US20230229074A1
公开(公告)日:2023-07-20
申请号:US17899616
申请日:2022-08-31
申请人: SEMES CO., LTD.
发明人: Hyo Won YANG , Hyun Yoon , Ji Hoon Jeong , In Ki Jung , Ki Hoon Choi , Tae Hee Kim , Se Hoon Oh
IPC分类号: G03F1/72
CPC分类号: G03F1/72
摘要: A photomask correction method capable of increasing the photomask precision is provided. The photomask correction method comprises measuring an intensity profile of a laser, acquiring etching amount data corresponding to the measured intensity profile using a library, determining a process parameter of the laser based on the etching amount data, and correcting a photomask with the laser according to the determined process parameter.
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公开(公告)号:US09975151B2
公开(公告)日:2018-05-22
申请号:US14749010
申请日:2015-06-24
申请人: Semes Co., Ltd.
发明人: Tae Keun Kim , Oh Jin Kwon , Ki Hoon Choi
CPC分类号: B08B3/10 , B08B3/12 , B08B7/028 , H01L21/67017 , H01L21/67051
摘要: Embodiments of the inventive concepts provide an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit supporting the substrate, and a liquid supply unit supplying a treatment solution to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle discharging the treatment solution to the substrate, a liquid supply line supplying the treatment solution to the nozzle, a mixing member installed on the liquid supply line, a mixing space formed within the mixing member, and a gas supply line connected to the mixing member to supply a gas into the mixing space. The mixing member includes a body within which the mixing space is formed, and an inflow port combined with the body such that the gas supplied through the inflow port is mixed with the treatment solution in the mixing space to form nano-sized bubbles.
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公开(公告)号:US11940734B2
公开(公告)日:2024-03-26
申请号:US17726343
申请日:2022-04-21
申请人: SEMES CO., LTD.
发明人: Ki Hoon Choi , Eung Su Kim , Pil Kyun Heo , Jin Yeong Sung , Hae-Won Choi , Anton Koriakin , Joon Ho Won
摘要: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.
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公开(公告)号:US11887866B2
公开(公告)日:2024-01-30
申请号:US16657983
申请日:2019-10-18
申请人: SEMES CO., LTD.
发明人: Jae Seong Lee , Hae Won Choi , Ki Hoon Choi , Anton Koriakin , Chan Young Heo , Do Heon Kim , Ji Soo Jeon
CPC分类号: H01L21/67028 , B08B3/04 , H01L21/67126
摘要: A supercritical processing apparatus includes an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof. A space is defined between the upper and lower vessels and configured to allow a substrate to be placed therein. The upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole.
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公开(公告)号:US20230341779A1
公开(公告)日:2023-10-26
申请号:US17726343
申请日:2022-04-21
申请人: SEMES CO., LTD.
发明人: Ki Hoon Choi , Eung Su Kim , Pil Kyun Heo , Jin Yeong Sung , Hae-Won Choi , Anton Koriakin , Joon Ho Won
摘要: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.
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