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公开(公告)号:US20240050990A1
公开(公告)日:2024-02-15
申请号:US18169630
申请日:2023-02-15
Applicant: SEMES CO., LTD.
Inventor: Do Hyung Kim , Dae Hun Kim , Young Jin Kim , Tae Ho Kang , Jun Gwon Lee , Young Joon Han , Eun Hyeok Choi
CPC classification number: B08B1/002 , H01L21/67046 , B08B3/02 , A46B9/005 , A46B9/02 , A46D1/0207 , A46B2200/3073
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.