公开(公告)号：US12272544B2

公开(公告)日：2025-04-08

申请号：US18145920

申请日：2022-12-23

Applicant: SEMES CO., LTD.

Inventor： Do Gyeong Ha ,  Moon Soon Choi ,  Young Joon Han ,  Seung Tae Yang

IPC: H01L21/02 ,  B08B3/02 ,  B08B13/00 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

公开(公告)号：US20240050990A1

公开(公告)日：2024-02-15

申请号：US18169630

申请日：2023-02-15

Applicant: SEMES CO., LTD.

Inventor： Do Hyung Kim ,  Dae Hun Kim ,  Young Jin Kim ,  Tae Ho Kang ,  Jun Gwon Lee ,  Young Joon Han ,  Eun Hyeok Choi

IPC: B08B1/00 ,  H01L21/67 ,  B08B3/02 ,  A46B9/00 ,  A46B9/02 ,  A46D1/00

CPC classification number: B08B1/002 ,  H01L21/67046 ,  B08B3/02 ,  A46B9/005 ,  A46B9/02 ,  A46D1/0207 ,  A46B2200/3073

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.

公开(公告)号：US20230207306A1

公开(公告)日：2023-06-29

申请号：US18145920

申请日：2022-12-23

Applicant: SEMES CO., LTD.

Inventor： Do Gyeong HA ,  Moon Soon CHOL ,  Young Joon Han ,  Seung Tae YANG

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B3/02 ,  B08B13/00

CPC classification number: H01L21/02057 ,  H01L21/67051 ,  H01L21/68764 ,  B08B3/022 ,  B08B13/00 ,  B08B2203/027

Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.