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公开(公告)号:US20230076790A1
公开(公告)日:2023-03-09
申请号:US17896782
申请日:2022-08-26
Applicant: SEMES CO., LTD.
Inventor: Kyung Min KIM , In Hwang PARK , Joo Jib PARK , Hyun Jin YANG , Ji Hyeong LEE
Abstract: According to an embodiment of the present invention, there are provided an exhaust assembly capable of uniformly forming an air flow in an exhaust step of discharging a gas to the outside, and a liquid processing apparatus and substrate processing equipment including the exhaust assembly. According to the present invention, the exhaust assembly that discharges a gas generated in a substrate processing process includes at least two or more intake ports into which the gas flows, a body portion that communicates with the intake ports and provides symmetrical paths for discharging the gas, a guide portion that is installed to guide a flow of the gas at the body portion, and an exhaust port from which the gas is discharged. The guide portion includes a flow guide that is installed to be adjacent to at least one of the intake ports and guides a direction of the gas to equally divide the flow of the gas, and a flow-rate guide that is installed around the intake port most adjacent to the exhaust port among the intake ports and is formed to reduce a cross-sectional area of a flow path of the gas.
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公开(公告)号:US20240142171A1
公开(公告)日:2024-05-02
申请号:US18099388
申请日:2023-01-20
Applicant: SEMES CO., LTD.
Inventor: Seung Hoon OH , Ji Hyeong LEE , Jin Se PARK , Yong Joon IM , Young Hun LEE , Yong Sun KO
CPC classification number: F26B5/005 , F26B21/10 , F26B25/003 , F26B25/16 , G03F7/168
Abstract: A substrate treating apparatus of the present disclosure comprises: a chamber member having an accommodation space configured to accommodate a vessel part where a substrate treatment region constituting a supercritical treatment space are formed, and an opening configured to move the substrate inside or outside; a shutter configured to open or close the chamber member; and a first exhaust part configured to discharge an internal air from the accommodation space to the outside, wherein the temperature of the substrate treatment region is increased.
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