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公开(公告)号：US12174553B2
公开(公告)日：2024-12-24
申请号：US17848841
申请日：2022-06-24
Applicant: SEMES CO., LTD.
Inventor： Tae Hoon Lee , Jong Gun Lee , Ki Sang Eum
Abstract: Provided is a support unit including a support plate on which the substrate is placed, and a support protrusion provided on the support plate and separating the substrate from the support plate, wherein the support plate includes a first protrusion protruding from an upper surface of the support plate, wherein the first protrusion is provided in a support region provided by the support protrusion.
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公开(公告)号：US12170191B2
公开(公告)日：2024-12-17
申请号：US18078958
申请日：2022-12-11
Applicant: SEMES CO., LTD.
Inventor： Jong Gun Lee , So Hyung Jiong , Hyung Joon Kim
IPC: H01J37/32 , H01L21/683
Abstract: Provided is a substrate supporting apparatus with improved durability. The substrate supporting apparatus includes a body configured to support a substrate and formed of a dielectric substance; a heat transfer medium supply hole installed to penetrate the body; a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode.
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公开(公告)号：US20240038508A1
公开(公告)日：2024-02-01
申请号：US18078958
申请日：2022-12-11
Applicant: SEMES CO., LTD.
Inventor： Jong Gun Lee , So Hyung Jiong , Hyung Joon Kim
IPC: H01J37/32 , H01L21/683
CPC classification number: H01J37/32724 , H01J37/32577 , H01L21/6833
Abstract: Provided is a substrate supporting apparatus with improved durability. The substrate supporting apparatus includes a body configured to support a substrate and formed of a dielectric substance; a heat transfer medium supply hole installed to penetrate the body; a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode.
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