公开(公告)号：US20210193894A1

公开(公告)日：2021-06-24

申请号：US17131618

申请日：2020-12-22

Applicant: SEOUL VIOSYS CO, LTD.

Inventor： Ik Kyu YOU ,  Jung Jae LEE

IPC: H01L33/62 ,  H01L25/075

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

公开(公告)号：US20210193497A1

公开(公告)日：2021-06-24

申请号：US17122995

申请日：2020-12-15

Applicant: SEOUL VIOSYS CO, LTD.

Inventor： Ik Kyu YOU ,  Jung Jae LEE

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.

公开(公告)号：US20240113271A1

公开(公告)日：2024-04-04

申请号：US18522885

申请日：2023-11-29

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu YOU ,  Jung Jae LEE

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

公开(公告)号：US20210181267A1

公开(公告)日：2021-06-17

申请号：US17121638

申请日：2020-12-14

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Young Ju LEE ,  lk Kyu YOU ,  Jung Jae LEE

IPC: G01R31/70 ,  H01L25/13

Abstract: A micro LED bond tester including a stage configured to mount a circuit board on which micro LEDs are mounted, and a gas blower configured to blow gas into at least one of the micro LEDs on the circuit board.