公开(公告)号：US10689493B2

公开(公告)日：2020-06-23

申请号：US15531587

申请日：2015-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Hiromi Otake ,  Aoi Nakano ,  Chika Yamashita ,  Yoshitaka Ishibashi ,  Hiroshi Uchida

IPC: C08J3/24 ,  C08K3/36 ,  C08F290/14 ,  C08L61/14 ,  C08G8/10 ,  C08G8/30 ,  C08K3/013 ,  C08G8/32 ,  C08K5/14

Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

公开(公告)号：US10160856B2

公开(公告)日：2018-12-25

申请号：US15533549

申请日：2015-12-11

Applicant: SHOWA DENKO K.K.

Inventor： Hiromi Otake ,  Aoi Nakano ,  Chika Yamashita ,  Yoshitaka Ishibashi ,  Hiroshi Uchida

IPC: C08L61/14 ,  C08L35/00 ,  C08L61/16 ,  C08K3/00 ,  C08F290/14 ,  C08K5/14 ,  C08K5/3415

Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).