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公开(公告)号:US20200033726A1
公开(公告)日:2020-01-30
申请号:US16500881
申请日:2018-04-06
Applicant: SHOWA DENKO K.K.
Inventor: Kentaro FURUE , Yuki MIYAISHI , Shiyuko NAKAMURA
Abstract: A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). Ra to Rd and * in the formulas are as defined in the Specification.
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公开(公告)号:US20180253003A1
公开(公告)日:2018-09-06
申请号:US15755336
申请日:2016-10-19
Applicant: SHOWA DENKO K.K.
Inventor: Kentaro FURUE , Yuki MIYAISHI
CPC classification number: G03F7/0236 , G03F7/0233 , G03F7/0388 , G03F7/0392 , G03F7/105 , H01L27/3246 , H01L27/3283 , H01L51/50 , H05B33/10 , H05B33/22
Abstract: Provided is a positive photosensitive resin composition having high sensitivity, high definition, and high adhesiveness and being capable of maintaining blackness and high light-blocking properties, even after a high-temperature curing step, e.g., at 250° C. This positive photosensitive resin composition contains: a binder resin (A); a quinonediazide compound (B); and at least one type of black dye (C) selected from black dyes specified by the color indexes of solvent black 27-47. The black dye (C) is ideally specified by the color index of solvent black 27, 29, or 34. This composition is capable of being suitably used in positive radiation lithography and can be used to form organic EL element partitions and insulating films.
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